Thermazig, Inc.

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TIF Series Thermally conductive gap fillers

TIF Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

Soft and Compressible for low stress applications

Naturally tacky needing no further adhesive coating

Good thermal conductive

Available in varies thickness

Application

Cooling components to the chassis of frame

High speed mass storage drives

RDRAM memory modules

Micro heat pipe thermal solutions

Automotive engine control units

Telecommunication hardware

Handheld portable electronics

Semiconductor automated test equipment (ATE)

Item	Color	Thickness (mm)	Hardness (Shore A )	Thermal Conductivity (W/m-K)	Continuous Use Temp (℃)	Specification	MSDS	ROHS
TIF600G	Garnet	0.254-5.08	35	6.2	-50～200	Detailed data	Detailed data	Detailed data
TIF600	Blue/Violet	0.254-5.08	30	4.7	-50～200	Detailed data	Detailed data	Detailed data
TIF500S	Blue	0.254-5.08	25	3.0	-50～200	Detailed data	Detailed data	Detailed data
TIF500	Violet	0.254-5.08	10	2.6	-50～200	Detailed data	Detailed data	Detailed data
TIF400	Yellow	0.254-5.08	30	2.0	-50～200	Detailed data	Detailed data	Detailed data
TIF100	Green	0.254-10.16	10	1.5	-50～200	Detailed data	Detailed data	Detailed data
TIF100soft	Violet/Green	0.254-10.16	8	1.25	-50～200	Detailed data	Detailed data	Detailed data

Thermazig, Inc. 3709 Pender St Burnaby B.C. Canada Email:sales@thermazig.com