| Features |
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One component paste like interface material, never dry |
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Thermal compound formulated to maximize the heat transfer |
Outstanding electrical insulation properties and will not hardenon long exposure to elevated temperatures |
Non-toxic and environmentally safe |
Application |
Semiconductor cases and heat sinks |
Power resistors and chassis, thermostats and mating surfaces,
and thermoelectric cooling devices |
CPU's and GPU's |
Automatic dispensing and screen-printing |
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Item |
Color |
Thermal Conductivity(W/mK) |
Thermal Impedance@50psi (℃-in2/W) |
Phase Change Softening Temperature(℃) |
Continuous Use Temp(℃) |
Specification |
MSDS |
ROHS |
TIC800 |
Gray |
4.2 |
0.01 |
50~60 |
-25~125 |
Detailed data |
Detailed data |
Detailed data |
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