TIC™ Series Low Melting Point Thermal
The TIC™ Series materials are polymers that reinforce heat and featured by phase transformation. In room temperature, TIC™ series materials are solid and easy to process. However, in operating temperature when the states of the component materials are about to change, TIC™ series materials quickly get softened and melted so as to completely fill the gaps between the heat dissipation elements and the electronic components with highly efficient heat conduction.
|
Item |
Color |
Thickness(mm) |
Thermal Conductivity(W/mK) |
Phase Change Softening Temperature(℃) |
Continuous Use Temp(℃) |
|
TIC800G Series |
Gray |
0.076-0.254 |
5.00 |
50～60 |
-25～125 |
|
TIC800A Series |
Gray |
0.076-0.254 |
2.50 |
50～60 |
-25～125 |
|
TIC800P Series |
Pink |
0.076-0.254 |
0.95 |
50～60 |
-25～125 |
|
TIC800Y Series |
Yellow |
0.076-0.254 |
0.95 |
50～60 |
-25～125 | |
|
