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Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard

Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard

  • Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard
  • Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard
Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1100-10UF thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Dielectric Breakdown Voltage: >5500 VAC Name: Hardness 75 Shore 00 Easy Release Construction Thermal Pad For Mainboard
Material: Silicone Keyword: Thermal Gap Pad
Dielectric Constant: 3.9 MHz Specific Gravity: 2.2 G/cc
High Light:

laptop mainboard 2.5mm thermal pad

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2.5mm thermal pad

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2.5mm heat sink pad for laptop

Hardness 75 Shore 00 Easy Release Construction Thermal Pad for Mainboard​

 

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

 

TIF100-10UF-Datasheet-REV02.pdf

 

Ziitek TIF1100-10UF thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

 

<Good thermal conductive:1.5 W/mK
<Thickness: 2.5mmT
<Hardness:75 Shore 00
<Colour: Gray

<Moldability for complex parts
<Outstanding thermal performance
<High tack surface reduces contact resistance

 

 

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices
 

 
Typical Properties of TIF1100-10UF
 
Product Name TIF1100-10UF Series
Colour gray
Construction & Compostion Ceramic filled silicone elastomer
Specific gravity 2.2 g/cc
Thickness 2.5mmT
Hardness 75 Shore 00
Dielectric constant@1MHz 3.9 MHz
Continuos Use Temp -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal conductivity 1.5 W/mK
Volume Resistivity 1.0*1012 Ohm-cm

 
 

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard 0
 

 

Our services

 

Online-service : 12 hours , Inquiry reply within fastest.


Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

Well-trained & experienced staff are to answer all your inquiries in English of course.

Standard Export Carton Or Marked With Customer's Information Or Customized.

Provide free samples

 

After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.

we will help you to deal with it and give you satisfactory solution.

 

Hardness 75 Shore 00 2.5mm Thermal Pad Easy Release Construction For Laptop Mainboard 1
 
FAQ

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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