Home ProductsCPU Thermal Pad

Popular manufactured 1.5W/MK CPU Thermal Pad Outstanding thermal performance For RDRAM Memory Modules

Popular manufactured 1.5W/MK CPU Thermal Pad Outstanding thermal performance For RDRAM Memory Modules

Popular  manufactured 1.5W/MK CPU Thermal Pad Outstanding thermal performance  For RDRAM Memory Modules
video
Popular  manufactured 1.5W/MK CPU Thermal Pad Outstanding thermal performance  For RDRAM Memory Modules
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF1100-07S Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm cantons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Contact Now
Detailed Product Description
Thickness: 2.5mmT Specific Gravity: 2.10g/cc
Dielectric Breakdown Voltage: >10000 VAC Thermal Conductivity: 1.5W/m-K
Color: Green
High Light:

RDRAM Memory Modules Thermally Conductive Pad

,

Thermally Conductive Pad 2.5mmT

,

1.5W/MK CPU Thermal Pad

Popular manufactured 1.5W/MK CPU Thermal Pad Outstanding thermal performance For RDRAM Memory Modules


The TIF1100-07S Series is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
 

Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance

> Electrically isolating
 

Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> routers
> Telecommunication hardware

> mainboard/mother board

> IT infrastructure

> GPS navigation and other portable devices

 

 
                                            Typical Properties of TIF1100-07S Series
 
Color
Green
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.10 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range 0.010"-0.200"
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
45 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

 

>10000 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp

 

-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.35%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
5.5 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20

 

Volume Resistivity
4.0X10"
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

 

 

Popular  manufactured 1.5W/MK CPU Thermal Pad Outstanding thermal performance  For RDRAM Memory Modules 0

Company Profile

 With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

FAQ

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

TIF100-07S Series Datasheet-REV02.pdf

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Sales Manager

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)

Other Products