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Chip Heat Sink Silicone Thermal Insulation Sheet , Industrial Thermal Insulation Fabric

Chip Heat Sink Silicone Thermal Insulation Sheet , Industrial Thermal Insulation Fabric

  • Chip Heat Sink Silicone Thermal Insulation Sheet , Industrial Thermal Insulation Fabric
  • Chip Heat Sink Silicone Thermal Insulation Sheet , Industrial Thermal Insulation Fabric
  • Chip Heat Sink Silicone Thermal Insulation Sheet , Industrial Thermal Insulation Fabric
Chip Heat Sink Silicone Thermal Insulation Sheet , Industrial Thermal Insulation Fabric
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIS800
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/pcs
Packaging Details: 24*23*12CM
Delivery Time: 3-6 work days
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Detailed Product Description
Keyword: Manufacturer Silicone Thermal Insulation Sheet Application: Chip Heat Sink
Continous Use Temp: -50 To 180℃ Compliance: UL & RoHS
Materials: Silicone Thermal Insulation Sheet Feature: Manufacturer Thermal Insulation Sheet
High Light:

fiberglass insulation heat resistance

,

thermal insulation sheet

,

Chip Heat Sink Thermal Insulation Sheet

Chip heat sink manufacturer silicone thermal insulation sheet TIS800 series

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street

lamps, Daylight lamps, LED Server Power products and others.

 

TIS800 Series Datasheet-(E)-REV01.pdf

 

The TIS™800 Series products are the high-efficiency insulation ones with thermal conduction properties. The supplement of the insulation base film made by silica gel into the heat-conduction material creates a great effect on both the insulation and heat conduction.


Features:


> Highly compliant surface characteristic with high thermal conductivity
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures


Applications:


> Power conversion equipment
> Power semiconductors:To packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers
> General high pressure interface

 

 

                                                             Typical Properties of TIS™800 Series

 

Product Name TISTM806 TISTM808 TISTM810 TISTM812 TISTM818 Test Method
Color Gray Gray Gray Gray Gray Visual
Construction &
Compostion
Ceramic filled silicone rubber ***
Composite Thickness 0.006"/0.152mm 0.008"/0.203mm 0.010"/0.254mm 0.012"/0.304mm 0.018"/0.457mm ASTM D751
Specific Gravity 2.2 g/cc ASTM D297
Heat Capacity 1 l/g-K ASTM C351
Hardness 50 Shore A ASTM 2240
Tensile Strength 450 psi >600 psi >600 psi >600 psi >600 psi ASTM D412
Continuos Use Temp (-58 to 356℉) / (-50 to 180℃) ***
Electrical  
Dielectric Breakdown Voltage >1500 VAC >3500 VAC >5000 VAC >5000 VAC >5000 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 5.0X10" Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal  
Thermal conductivity 1.6 W/m-K ASTM D5470
Thermal Impedance @50psi 0.21℃-in²/W 0.35℃-in²/W 0.82℃-in²/W 1.23℃-in²/W 1.83℃-in²/W ASTM D5471
 

Standard Thicknesses:
0.009"(0.228mm) 0.012"(0.304mm)
0.018"(0.457mm)
Consult the factory alternate thickness.

 

Standard Sizes:
12" x 160'(304mm x 48.76M)
Individual die cut shapes can be supplied.

 

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on doule side with "A2" suffix.

 

Reinforcement:
TIS™ series sheets are fiberglass reinforced.

 

Chip Heat Sink Silicone Thermal Insulation Sheet , Industrial Thermal Insulation Fabric 0

 

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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