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3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame
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3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF500S Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm cantons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Products Name: 3W/mK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame Keyword: Easily Attached Thermal Gap Filler
Application: LED Panel Light Thermal Conductivity: 3W/mK
Feature: China Supplier Keywords: Thermal Gap Pad Filler
Highlight:

heat conductive pad

,

gap filler pad

,

LED Panel Light Thermal Gap

3W/mK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame

 
The TIF™500S Series TIFTM500s Series thermally conductive interface materials are applied to fillthe air gaps between the heating elements and the heat dissipation fins orthe metal base.Their flexibility and elasticity make them suited to coat veryuneven surfaces.Heat can transmit to the metal housing or dissipation platefrom the heating elements or even the entire PCB, which effecitly enhancesthe efficiency and life-time of the heat-generating electronic components.


Features
 
> Good thermal conductive
> Soft and compressible for low stress applications
> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
 
Applications
 
> CPU
> display card
> mainboard/mother board
> notebook
> power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

 

Typical Properties of TIF500S Series
Color Blue Visual
Construction Ceramic filled silicone elastomer **********
Thermal Conductivity 3.2 W/mK ASTM D5470
Hardness 45 Shore 00 ASTM 2240
Specific Gravity 3.0 g/cc ASTM D297
Thickness range 0.020"-0.200" (0.5mm-5.0mm) ASTM D374
Dielectric Breakdown Voltage (T= 1mm above) >5500 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Continuous Use Temp – 40 To 160℃ **********
Outgassing (TML) 40% ASTM E595
Flame Rating 94-V0 UL E331100
 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.


Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
 
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
 
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

 

3W/MK Thermal Conductive Gap Filler Pads For Cooling Components To The Chassis Of Frame 0
Company profile
 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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