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1.5 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 27 shore00 for LED light

1.5 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 27 shore00 for LED light

  • 1.5 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 27 shore00 for LED light
  • 1.5 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 27 shore00 for LED light
  • 1.5 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 27 shore00 for LED light
1.5 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 27 shore00 for LED light
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF180-12U Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm cantons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Thickness: 2.0mmT Specific Gravity: 2.13 G/cc
Dielectric Breakdown Voltage: >5000 VAC Thermal Conductivity: 1.5W/m-K
High Light:

Ultrasoft Blue Thermal Gap Filler

,

94 V0 Thermal Gap Filler

,

1.5W/m-K Silicone Thermal Pad

1.5 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 27 shore00 for LED light

 

Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 
The TIF180-12U Series  thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.
 
Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance

> Moldability for complex parts

> Soft and compressible for low stress applications


Applications
LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
routers
Telecommunication hardware

> display card

> mainboard/mother board

> Mass storage devices

 

TIF100-12U Series Datasheet-(E)-REV02-CRM.pdf

 

 
                                            Typical Properties of TIF180-12U Series
 
Color
Blue
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.13 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range 0.010"-0.200"
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
27 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

 

>5000 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp

 

-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.55%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
5.5 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20

 

Volume Resistivity
4.0X10"
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
 
Packaging Details & Lead time
 
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
 
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

 

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

1.5 W/m-K Ultrasoft Low Thermal Resistance High Temperature blue Thermal Gap Filler 27 shore00 for LED light 0

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

 

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

 

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.

 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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