High performance thermal conductive pad can easily solve the heat dissipation problem of intelligent robot

With the continuous progress of science and technology, various types of robots developed by modern science and technology have been widely used in many fields. At present, intelligent robots put into the market are mainly to achieve specific functions.There are a large number of electronic devices distributed in the control system of robots, such as controllers, motor drives and various sensors.

As the temperature increases, the failure rate of electronic components will increase exponentially. Like most electronic products, the robot also needs to dissipate heat to maintain stable operation. The controller structure of the main board will be equipped with a radiator according to the position of the heat source. In the middle, thermal conductive interface materials are needed to conduct heat, and thermal conductive silica gel sheet is one of the commonly used thermal conductive interface materials.

Ziitek high performance thermal pad has good characteristics, which can meet the heat dissipation needs of intelligent robots. The use of thermal conductivity silica gel sheet can also help heat dissipation efficiency, to ensure its stability. The thermal conductivity silica gel sheet also has very good thermal conductivity, which can effectively transfer heat from the intelligent robot chip, and can fill the tiny gap between the radiator and the chip, thus improving the efficiency of heat transfer.

TIF thermal conductive pad product features:
1. good thermal conductivity: 1.2~25W/mK
2. a variety of thickness options: 0.5mm-5.0mm
3. fire rating: UL94-V0
4. insulation and heat conduction, soft and elastic
5. suitable for low pressure application ring