Thermal conductive materials empower the new era and have become a rigid demand for AI, 5G, and new energy

At present, the top ten potential 5G application scenarios are: cloud VR/AR, Internet of Vehicles, intelligent manufacturing, smart energy, wireless healthcare, wireless home entertainment, connected drones, social networks, personal AI assistants, and smart cities. Then, with the advent of the new era, the rapid development of science and technology, the coverage of the 5G communication interconnection era, and the upgrade of hardware components, the power consumption of equipment continues to increase, and the heat also rises rapidly. Electronic products, including new energy, AI, 5G and other fields, will face thorny heat dissipation problems.

In order to solve its problem, the key material is: thermal conductive material, which is a new type of industrial material, which is designed for the thermal conduction requirements of equipment. The advantages of its excellent material properties and suitability for a wide range of environments and needs contribute to a high level of integration and ultra-small, slim spaces.

In machines and equipment, there is a gap between the heat source and the heat sink, so the heat transfer between the two is hindered and the heat dissipation effect is affected, so it is important to use heat conductive materials. The thermally conductive material completely fills the gap between the heat sink and the heat source and removes air from the gap, reducing the contact thermal resistance between the two. In addition to the heat sink, thermally conductive materials are also indispensable for dissipating heat from inside the device to the outside, allowing the heat sink to exert its power to ensure that machines and equipment operate within the right temperature range.