Why choose thermal conductive gel for heat dissipation of mobile phone motherboard?

The reasons for choosing thermal conductive gel for heat dissipation of mobile phone motherboard are as follows:

1. High thermal conductivity: Thermal conductive gel has high thermal conductivity, which can range from 1.5~7.0W/mK. This material can quickly transfer the heat generated by the mobile phone chip to the radiator, thereby effectively reducing the working temperature of the mobile phone chip and ensuring the stable operation of the mobile phone.

2. Flexibility and low thermal impedance: the thermal conductive gel has a soft texture, almost no pressure between the device and the device, and low thermal impedance, which can fill the small gaps between electronic components, achieve comprehensive coverage of high-temperature parts, effectively reduce the temperature in the hot spot area, and reduce the temperature difference between other parts of the mobile phone.

3. Fire performance: The thermal conductive gel meets the UL94V0 fire rating, which can increase the safety of the mobile phone.

4. Automated production: Thermally conductive gel can meet the operation of automatic dispensing machine, save manpower and reduce production costs. 5. Prevent separation: The thermal conductive gel is mixed with filler, which can prevent the separation of the adhesive and the filler. 6. Reliability: Because the thermal conductive gel is naturally adhesive, and there will be no problems of oil and drying, it has certain advantages in reliability and is more popular with manufacturers than other heat dissipation materials.