Name: High Viscosity 3W/MK Thermally Conductive Putty For BGA Package
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF030-05
Price: 49.10 USD
Availability: InStock

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High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF030-05

Payment & Shipping Terms:

Minimum Order Quantity:	1000tube
Price:	0.1-100USD/KG
Packaging Details:	300cc/tube
Delivery Time:	3-8 WORK DAYS
Payment Terms:	T/T
Supply Ability:	10000KG/MONTH

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Detailed Product Description

Application:	BGA Package	Color:	Light Blue
Made By:	Silicon Oil	Keyword:	Thermally Conductive Putty For BGA Putty
Viscosity:	2000,000cps
Highlight:	3W/MK Thermally Conductive Putty , High Viscosity Thermally Conductive Putty , BGA Package Thermal Conductive Putty

3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

TIF030-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF100-15 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF030-05 operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-15 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

TIF030-05 Series Datasheet-REV02.pdf

Application

> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe ,Vihicel enginee controler
> Telecom industry

Feature

> Thermal conductivity: 3W/mK
> Soft, very low compression
> Operate automaticly

TIF^TM030-05 Property
Color	Blue	Visual
Construction & Composition	Ceramic filled silicon material	**********
Viscosity	2000,000cps	GB/T 10247
Specific Gravity	2.95 g/cc	ASTM D297
Thermal conductivity	3.0 W/mK	ISO 22007-2
Thermal diffusivity	1.053 mm²/s	ISO 22007-2
Specific heat capacity	3.2 MJ/m³K	ISO 22007-2
Continuous Use Temperature	-45 ~200°C	******
Dielectric breakdown strength	200 V/mil	ASTM D149
Flame Rating	94V0	E331100
Outgassing,%TML	0.80%	ASTM E595

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

ken by us to assure that the goods are in a good condition during storage and delivery.

Tag:

Contact Person: Dana Dai

Tel: +86 18153789196

High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

3W/MK Thermally Conductive Putty

High Viscosity Thermally Conductive Putty

BGA Package Thermal Conductive Putty

heat transfer putty,

thermally conductive gap filler,

heat insulation putty