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High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

  • High Viscosity 3W/MK Thermally Conductive Putty For BGA Package
  • High Viscosity 3W/MK Thermally Conductive Putty For BGA Package
High Viscosity 3W/MK Thermally Conductive Putty For BGA Package
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF030-05
Payment & Shipping Terms:
Minimum Order Quantity: 1000tube
Price: 0.1-100USD/KG
Packaging Details: 300cc/tube
Delivery Time: 3-8 WORK DAYS
Payment Terms: T/T
Supply Ability: 10000KG/MONTH
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Detailed Product Description
Application: BGA Package Color: Light Blue
Made By: Silicon Oil Keyword: Thermally Conductive Putty For BGA Putty
Viscosity: 2000,000cps
High Light:

3W/MK Thermally Conductive Putty


High Viscosity Thermally Conductive Putty


BGA Package Thermal Conductive Putty

3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package


Company Profile

 Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


TIF030-05 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIF100-15 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal pad, it can control bonded shifiting issue much better.
TIF030-05  operation mold is simliar as grease ,such as silkprint and screen print or automatic injected facility. TIF100-15 can be applied on chip micro processor,PPGAs,Micro BGA package,BGA package,DSP chip,LED lighting and other high power electric component .

TIF030-05 Series Datasheet-REV02.pdf

> Heat-sink & frame
> LED backlight module,LED lighting
> High speed hardware driver
> Micro heat pipe ,Vihicel enginee controler
> Telecom industry
> Thermal conductivity:  3W/mK
> Soft, very low compression
> Operate automaticly



TIFTM030-05 Property
Color Blue Visual
Construction & Composition Ceramic filled silicon material **********
Viscosity 2000,000cps GB/T 10247
Specific Gravity 2.95 g/cc ASTM D297
Thermal conductivity 3.0 W/mK ISO 22007-2
Thermal diffusivity 1.053 mm2/s ISO 22007-2
Specific heat capacity 3.2 MJ/m3K ISO 22007-2
Continuous Use Temperature -45 ~200°C ******
Dielectric breakdown strength 200 V/mil ASTM D149
Flame Rating 94V0 E331100
Outgassing,%TML 0.80% ASTM E595

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

We offer the custom packaged in syringes for automated despensing applications.Please contact us for confirming.



High Viscosity 3W/MK Thermally Conductive Putty For BGA Package 0

Ziitek Culture


Quality :

Do it right the first time, total quality control


Work precisely and thoroughly for effectiveness


Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.




Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

ken by us to assure that the goods are in a good condition during storage and delivery.



Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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