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thermal gap pad TIF400 yellow

导热硅胶片
January 30, 2021
Category Connection: Most Popular Products
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Tags:
#gap filler pad #heat conductive pad #2W/MK Thermal Pad
Brief: Discover the TIF400 Thermal Pad, a high-performance 2W/MK silicon thermal pad designed for telecommunication hardware. This yellow thermal gap pad offers excellent thermal conductivity, moldability, and low-stress applications. Perfect for RDRAM memory modules, automotive engine control units, and more.
Related Product Features:
  • Good thermal conductivity with 2.0 W/mK performance.
  • Moldable for complex parts and tight spaces.
  • Soft and compressible for low-stress applications.
  • Naturally tacky, eliminating the need for adhesive coatings.
  • Available in various thicknesses from 0.5mm to 5.0mm.
  • Electrically isolating material for high-voltage applications.
  • UL94 V-0 flame rating for safety compliance.
  • Suitable for telecommunication hardware and LED-lit devices.
Faqs:
  • What is the thermal conductivity of the TIF400 Thermal Pad?
    The TIF400 Thermal Pad has a thermal conductivity of 2.0 W/mK, making it highly effective for heat dissipation.
  • Can the TIF400 Thermal Pad be used in high-voltage applications?
    Yes, the TIF400 is an electrically isolating material, making it suitable for high-voltage, bare-leaded devices.
  • What thickness options are available for the TIF400 Thermal Pad?
    The TIF400 is available in thicknesses ranging from 0.5mm to 5.0mm, with standard and custom options upon request.
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