Brief: Discover the TIC™800P Series PCM Phase Change Material, designed for communications equipment and wireless stations. This pink thermal interface material softens at 50℃, reducing thermal resistance with no performance degradation after 1,000 hours at 130℃. Ideal for CPUs, display cards, and more.
Related Product Features:
Low melting point thermal interface material that softens at 50℃ to fill microscopic irregularities.
Flexible solid at room temperature with no reinforcing components for optimal thermal performance.
No thermal performance degradation after 1,000 hours at 130℃ or 500 cycles from -25℃ to 125℃.
Naturally tacky at room temperature, eliminating the need for adhesives.
Thermal resistance of 0.024℃-in²/W for efficient heat dissipation.
Available in standard thicknesses of 0.005", 0.008", and 0.010".
Suitable for applications like CPUs, display cards, and power supplies.
Comes with white release paper and bottom liner for easy handling.
Faqs:
What is the softening temperature of the TIC™800P Series?
The TIC™800P Series begins to soften at 50℃, allowing it to fill microscopic irregularities for reduced thermal resistance.
Does the TIC™800P Series require adhesives?
No, the material is naturally tacky at room temperature, so no adhesives are required.
What are the typical applications for the TIC™800P Series?
The TIC™800P Series is ideal for CPUs, display cards, mainboards, notebooks, power supplies, heat pipe thermal solutions, memory modules, and mass storage devices.