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thermal conductive pad TIF100-02Light grey

导热硅胶片
January 30, 2021
Category Connection: Silicone Thermal Pad
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Tags:
#heat conductive pad #gap filler pad #thermal cooling pad
Brief: Discover the TIF100-02F Series, a high-performance thermal conductive silicone pad designed for efficient heat dissipation in electronic products. This light grey, customizable pad offers excellent thermal conductivity (1.5W/mK) and is ideal for CPUs, GPUs, and power supplies. Enhance your device's longevity with this reliable thermal solution.
Related Product Features:
  • Good thermal conductivity of 1.5W/mK for efficient heat dissipation.
  • Broad range of hardnesses available to suit various applications.
  • Moldable for complex parts, ensuring a perfect fit for uneven surfaces.
  • Outstanding thermal performance to enhance electronic component lifespan.
  • High-temperature resistance, operating from -40°C to 160°C.
  • UL94 V0 fire rating for added safety in electronic devices.
  • Available in multiple thicknesses from 0.020" to 0.200" for customization.
  • Can be reinforced with fiberglass for added durability.
Faqs:
  • What is the thermal conductivity of the TIF100-02F Series?
    The TIF100-02F Series offers a thermal conductivity of 1.5W/mK, ensuring efficient heat dissipation for electronic components.
  • What temperature range can the thermal conductive silicone pad withstand?
    This silicone pad can operate in temperatures ranging from -40°C to 160°C, making it suitable for various high-temperature applications.
  • Can the TIF100-02F Series be customized for specific applications?
    Yes, the TIF100-02F Series can be customized in terms of thickness, hardness, and reinforcement (e.g., fiberglass) to meet specific application requirements.
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