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| Place of Origin: | China |
| Brand Name: | Ziitek |
| Certification: | UL & RoHS |
| Model Number: | TIF700P Series |
| Minimum Order Quantity: | 1000pcs |
|---|---|
| Price: | 0.1-10 USD/PCS |
| Packaging Details: | 24*13*12cm cartons |
| Delivery Time: | 3-5 work days |
| Payment Terms: | T/T |
| Supply Ability: | 1000000 pcs/month |
| Product Name: | Hot Selling Factory Customizable 7.5W/MK Thermal Pads For Memory Modules | Application: | Memory Modules |
|---|---|---|---|
| Specific Gravity: | 3.3g/cc | Hardness: | 45 Shore 00 |
| Continuos Use Temp: | -40 To 160℃ | Keywords: | Thermal Pad |
| Thermal Conductivity: | 7.5W/m-K | ||
| Highlight: | heat conductive pad,thermal cooling pad,Thermal Pads For RDRAM Memory Modules |
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Hot Selling Factory Customizable 7.5W/MK Thermal Pads For Memory Modules
The TIF™700P Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features
> Good thermal conductive: 7.5 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
| Typical Properties of TIF700P Series | ||||
| Color | Gray | Visual | Composite Thickness | Thermal Impedance @10psi |
| (℃-in²/W) | ||||
| Construction & Compostion | Ceramic filled silicone elastomer | ******* | 10mils / 0.254 mm | 0.16 |
| 20mils / 0.508 mm | 0.2 | |||
| Specific Gravity | 3.3 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
| 40mils / 1.016 mm | 0.36 | |||
| Thickness range | 0.020"-0.200" | ASTM C351 | 50mils / 1.270 mm | 0.42 |
| 60mils / 1.524 mm | 0.48 | |||
| Hardness | 45 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
| 80mils / 2.032 mm | 0.63 | |||
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 | 90mils / 2.286 mm | 0.73 |
| 100mils / 2.540 mm | 0.81 | |||
| Operating Temp | -40 ~160℃ | ******* | 110mils / 2.794 mm | 0.86 |
| 120mils / 3.048 mm | 0.93 | |||
| Outgassing(TML) | 0.30% | ASTM E595 | 130mils / 3.302mm | 1 |
| 140mils /3.556 mm | 1.08 | |||
| Dielectric Constant | 4.5 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
| 160mils / 4.064 mm | 1.2 | |||
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.24 |
| 180mils / 4.572 mm | 1.32 | |||
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
| 200mils / 5.080 mm | 1.52 | |||
| Thermal conductivity | 7.5W/mK | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Contact Person: Dana Dai
Tel: +86 18153789196
