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Heat Sinking Silicone Thermal Pad Garnet Handheld Portable Electronics UL RoHs Approved

Heat Sinking Silicone Thermal Pad Garnet Handheld Portable Electronics UL RoHs Approved

Heat Sinking Silicone Thermal Pad Garnet Handheld Portable Electronics UL RoHs Approved
Heat Sinking Silicone Thermal Pad Garnet Handheld Portable Electronics UL RoHs Approved

Product Details:

Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF600GP Series

Payment & Shipping Terms:

Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm cantons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Feature: UL & RoHS Compliance Thermal Conductivity: 6 W/mK
Application: Heat Sinks Heat Capacity: 1 L/g-K
Keywords: UL/RoHs Thermal Pad Outgassing: 0.32%
High Light:

heat conductive pad

,

thermal cooling pad

UL/RoHs Heat Sinking pad Garnet high thermal conductivity 6W silicone Thermal pad

 

The TIF™600GP Series The heat conduction interface material is used to fill the air gap between the heating element and the heat sink or metal substrate. Their flexibility and elasticity make them suitable for coatings on very uneven surfaces. Heat can be transferred from individual components or even the entire printed circuit board to a metal case or heat sink.

Features


> Good thermal conductive: 6.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

 

Applications


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
>  Handheld portable electronics
> Semiconductor automated test equipment (ATE)

 
 
                                             Typical Properties of TIF™600GP Series
 
Color
Garnet
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.95 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Heat Capacity
1 l/g-K
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
45 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.32%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-50 to 200℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>10000 VAC
ASTM D149

130mils / 3.302mm

1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.5 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
4.2X1012
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
6.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470
 
 

 

Standard Thicknesses:


0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.


Standard Sheets Sizes:


8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:


Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:


TIF™ series sheets type can add with fiberglass reinforced.

Heat Sinking Silicone Thermal Pad Garnet Handheld Portable Electronics UL RoHs Approved 0

 
 

Contact Details
Dongguan Ziitek Electronic Materials & Technology Ltd

Contact Person: Sales Manager

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