Brief: Discover the Garnet Telecommunication Hardware Naturally Tacky 6.2 W Silicon Thermal Pad, available in thicknesses from 0.25mm to 5.08mm. Perfect for enhancing thermal efficiency in IT infrastructure, LED applications, and more. Learn about its outstanding thermal performance and high tack surface.
Related Product Features:
Silicone-based thermally conductive gap pad with 6.2 W/mK thermal conductivity.
Available in thicknesses ranging from 0.25mm to 5.08mm for versatile applications.
High tack surface reduces contact resistance for better thermal transfer.
Flexible and elastic, suitable for uneven surfaces and complex parts.
Flame-rated 94 V0 for safety in electronic applications.
Operates in a wide temperature range from -40°C to 160°C.
Options for pressure-sensitive adhesive on one or both sides.
Can be reinforced with fiberglass for added durability.
Faqs:
What is the thermal conductivity of the TIF600G Series thermal pad?
The TIF600G Series thermal pad has a thermal conductivity of 6.2 W/mK, ensuring efficient heat transfer.
What thickness options are available for the TIF600G Series?
The TIF600G Series is available in thicknesses ranging from 0.25mm to 5.08mm, with standard options at various increments.
Can the TIF600G Series thermal pad be customized with adhesive?
Yes, the TIF600G Series can be customized with pressure-sensitive adhesive on one side (A1 suffix) or both sides (A2 suffix) upon request.