thermal conductive pad TIF500 Purple

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thermal conductive pad TIF500 Purple

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January 30, 2021

Category Connection: Most Popular Products

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Tags:

#gap filler pad #heat conductive pad #2.6W/mK Silicone Thermal Pad

Brief: Discover the Violet Customizable Thermal Pad, a high-performance silicon thermal pad designed for efficient heat dissipation in electronic components. The TIF500 Series offers excellent thermal conductivity, flexibility, and customization options for various applications.

Related Product Features:

Good thermal conductivity with 2.6 W/mK for efficient heat transfer.
Available in various thicknesses from 0.25mm to 5.0mm to suit different needs.
Broad range of hardness options for versatile applications.
Moldable for complex parts, ensuring a perfect fit.
Outstanding thermal performance enhances component lifespan.
Flame-rated 94 V0 for safety in high-temperature environments.
Customizable with pressure-sensitive adhesive on one or both sides.
Reinforcement options include fiberglass for added durability.

Faqs:

What is the thermal conductivity of the TIF500 Series thermal pad?

The TIF500 Series thermal pad has a thermal conductivity of 2.6 W/mK, ensuring efficient heat transfer.
Can the thermal pad be customized with adhesive?

Yes, the thermal pad can be customized with pressure-sensitive adhesive on one side (A1 suffix) or both sides (A2 suffix).
What are the typical applications for this thermal pad?

Typical applications include RDRAM memory modules, automotive engine control units, telecommunication hardware, and handheld portable electronics.
Is fiberglass reinforcement available for the TIF500 Series?

Yes, fiberglass reinforcement can be added to the TIF500 Series sheets for enhanced durability.