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thermal gap padTIF100-07Light green

导热硅胶片
January 30, 2021
Category Connection: Silicone Thermal Pad
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Tags:
#heat conductive pad #gap filler pad #thermal cooling pad
Brief: Discover the TIF100-07 Light Green Thermal Gap Pad, a high-performance silicone thermal pad with 1.5W/mK conductivity and thickness options from 0.5mm to 5.0mm. Perfect for game machines, CPUs, and more, this UL-recognized pad ensures efficient heat dissipation and low stress applications.
Related Product Features:
  • Thermal conductivity of 1.5W/mK for efficient heat dissipation.
  • Available in thicknesses ranging from 0.5mm to 5.0mm.
  • UL recognized for safety and reliability.
  • High tack surface reduces contact resistance.
  • Soft and compressible for low stress applications.
  • Flame rating of 94 V0 for enhanced safety.
  • Suitable for a wide range of applications including CPUs and game machines.
  • Custom thickness and die-cut shapes available upon request.
Faqs:
  • What is the thermal conductivity of the TIF100-07 Thermal Pad?
    The thermal conductivity is 1.5W/mK, ensuring efficient heat dissipation.
  • What thickness options are available for this thermal pad?
    The pad is available in thicknesses ranging from 0.5mm to 5.0mm.
  • Is the TIF100-07 Thermal Pad UL recognized?
    Yes, this thermal pad is UL recognized, ensuring safety and reliability.
  • What applications is this thermal pad suitable for?
    It is suitable for CPUs, game machines, telecommunication hardware, and more.
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