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thermal gap padTIF100-05Light blue

导热硅胶片
January 30, 2021
Category Connection: Silicone Thermal Pad
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Tags:
#heat conductive pad #gap filler pad #thermal cooling pad
Brief: Discover the TIF120-05S blue thermal pad, a high-performance solution for memory modules with 1.5W/MK thermal conductivity. Ideal for various applications, this UL94V0 certified pad ensures efficient heat dissipation and stability from -40℃ to 160℃.
Related Product Features:
  • 1.5W/mK thermal conductivity for efficient heat dissipation.
  • Available in thicknesses from 0.5mm to 5.0mm for versatile applications.
  • UL94V0 certified for safety and reliability.
  • Low oil permeability and high softness for easy handling.
  • Stable performance in temperatures ranging from -40℃ to 160℃.
  • High tack surface reduces contact resistance for better thermal transfer.
  • Soft and compressible, ideal for low-stress applications.
  • Easy release construction for convenient installation.
Faqs:
  • What is the thermal conductivity of the TIF120-05S thermal pad?
    The TIF120-05S thermal pad has a thermal conductivity of 1.5W/mK, ensuring efficient heat dissipation for memory modules and other applications.
  • What temperature range can the TIF120-05S thermal pad withstand?
    This thermal pad can operate stably in temperatures ranging from -40℃ to 160℃, making it suitable for various demanding environments.
  • Is the TIF120-05S thermal pad UL certified?
    Yes, the TIF120-05S thermal pad is UL94V0 certified, ensuring it meets high safety and reliability standards.
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