Name: Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-01E
Price: 4.10 USD
Availability: InStock

Home Products Silicone Thermal Pad

Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF100-01E

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Product Name:	Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu	Thickness:	1.5mmT
Keywords:	Thermal Pad	Specific Gravity:	2.3g/cc
Dielectric Breakdown Voltage:	>5500 VAC	Thermal Conductivity:	1.5W/m-K
Color:	Black	Sample:	Sample Available
Application:	Electronic Component Gap Filling
Highlight:	1.5W/M-K Thermal Conductive Pad , Thermal Conductive Pad 45 Shore 00 , 94 V0 thermal gap pad

Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

The TIF160-06E Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu 0
Features

> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance

> Electrically isolating

Applications

> display card
> mainboard/mother board
> notebook
> power supply
> CPU
> Memory Modules
> routers
> Telecommunication hardware

> mainboard/mother board

> IT infrastructure

> Automotive electronics

Typical Properties of TIF100-66U Series
Property	Value	Test method
Color	Black	Visual
Construction & Compostion	Ceramic filled silicone elastomer	******
Density	2.3g/cm³	ASTM D297
Thickness range	0.020"(0.5mm)~0.200"(5.0mm)	******
Hardness	35 Shore 00	ASTM 2240
Continuos Use Temp	-45 to 200℃	******
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	4.7 MHz	ASTM D150
Volume Resistivity(Ohm-cm)	1.0X10¹²	ASTM D257
Fire rating	94 V0	UL equivalent
Thermal conductivity	1.5W/m-K	ASTM D5470

Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
Individual die cut shapes and custom thickness can be supplied.

Please contact us of confirming.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu 1

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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