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1.2W/mK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

1.2W/mK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

    • 1.2W/mK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
    • 1.2W/mK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured
  • 1.2W/mK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

    Product Details:

    Place of Origin: China
    Brand Name: Ziitek
    Certification: RoHS
    Model Number: TIS580-12

    Payment & Shipping Terms:

    Minimum Order Quantity: 10kg
    Price: 1-100USD/KG
    Packaging Details: 1kg/can
    Delivery Time: 3-8 work days
    Payment Terms: T/T
    Supply Ability: 10000kg/month
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    Detailed Product Description
    Material: Silicone Adhesive Keyword: Low Shrinkage And Viscosity
    Total Cure Time: 3-7 Days (25℃) Hardness: 25(Shore A)
    Name: Thermally Conductive Silicone Adhesive Feature: Dealcoholized, 1 Component, Room Temperature Cure

    Room temperature cured thermal conductive silicone adhesive Low shrinkage and viscosity

     

    TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.

     

    TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.

    TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

     

    Feature

     

    > Good thermal conductivity: 1.2W/mK

    > Good maneuverability and good adhesion

    > Low shrinkage

    > Low viscosity, leads to void-free surface

    > Good solvent resistance, water resistance

    > Longer working life

    > Excellent thermal shock resistance

     

    Application

     

    It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-12, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
    E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers
     

     

                                        Typical values of TISTM580-12

     

    Appearance White paste Test Method
    Density(g/cm3,25℃) 1.2 ASTM D297
    Tack-free time(min,25℃) ≤20 *****
    Cure type(1-component) Dealcoholized *****
    Viscosity@25℃ Brookfield (Uncured) 5000 cps ASTM D1084
    Total cure time(d, 25℃) 3-7 *****
    Elongation(%) ≥150 ASTM D412
    Hardness(Shore A) 25 ASTM D2240
    Lap Shear Strength(MPa) ≥2.0 ASTM D1876
    Peel Strength(N/mm) >3.5 ASTM D1876
    Operation temperature(℃) -60~250 *****
    Volume Resistivity(Ω·cm) 2.0×1016 ASTM D257
    Dielectric Strength(KV/mm) 21 ASTM D149
    Dielectric Constant (1.2MHz) 2.9 ASTM D150
    Thermal Conductivity W/(m·K) 1.2 ASTM D5470
    Flame Retardancy UL94 V-0 E331100

     

    Package:
    300ml/tube
    1.2W/mK Thermal Conductive Silicone Adhesive Low Shrinkage Viscosity Room Temperature Cured

    Contact Details
    Dongguan Ziitek Electronic Materials & Technology Ltd

    Contact Person: Sales Manager

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