|Place of Origin:||China|
|Minimum Order Quantity:||10kg|
|Delivery Time:||3-8 work days|
|Material:||Silicone Adhesive||Keyword:||Low Shrinkage And Viscosity|
|Total Cure Time:||3-7 Days (25℃)||Hardness:||25（Shore A）|
|Name:||Thermally Conductive Silicone Adhesive||Feature:||Dealcoholized, 1 Component, Room Temperature Cure|
thermal bonding adhesive,
high temperature conductive adhesive,
Thermal Conductive Silicone Adhesive Low Shrinkage
Room temperature cured thermal conductive silicone adhesive Low shrinkage and viscosity
Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.
TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.
TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.
TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
TIS580-12 Series Datasheet-(E)-REV01.pdf
> Good thermal conductivity: 1.2W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
Typical values of TISTM580-12
|Appearance||White paste||Test Method|
|Viscosity@25℃ Brookfield (Uncured)||5000 cps||ASTM D1084|
|Total cure time(d, 25℃)||3-7||*****|
|Hardness(Shore A)||25||ASTM D2240|
|Lap Shear Strength(MPa)||≥2.0||ASTM D1876|
|Peel Strength(N/mm)||＞3.5||ASTM D1876|
|Volume Resistivity(Ω·cm)||2.0×1016||ASTM D257|
|Dielectric Strength(KV/mm)||21||ASTM D149|
|Dielectric Constant (1.2MHz)||2.9||ASTM D150|
|Thermal Conductivity W/(m·K)||1.2||ASTM D5470|
|Flame Retardancy||UL94 V-0||E331100|
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Contact Person: Sales Manager