Name: 0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF200-02E series
Price: 4.10 USD
Availability: InStock

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0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF200-02E series

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Products Name:	0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink	Feature:	Soft And Compressible For Low Stress Applications
Application:	GPU CPU Chip	Thickness Range:	0.5~5 Mm
Keywords:	Thermal Pad	Color:	Pink/ White
Hardness:	35 Shore 00	Thermal Conductivity:	1.25W/m-K
Highlight:	heat conductive pad , gap filler pad , Laptop GPU Applicative Thermal Pad

0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink

The TIF™200-02E Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features
> Good thermal conductive: 1.25 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink 0
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook

Typical Properties of TIF200-02E Series
Color	Gray / White	Visual
Construction Reinforcement Carrier	Ceramic filled silicone elastomer	**********
Thermal Conductivity	1.25 W/mK	ASTM D5470
Hardness	35 Shore 00	ASTM 2240
Specific Gravity	2.2g/cc	ASTM D297
Thickness range	0.020"-0.200" (0.5mm-5.0mm)	ASTM D374
Dielectric Breakdown Voltage (T= 1mm above)	>5500 VAC	ASTM D149
Dielectric Constant	4.0MHz	ASTM D150
Volume Resistivity	1.0X10¹² Ohm-meter	ASTM D257
Continuous Use Temp	– 40 To 160 ℃	**********
Outgassing (TML)	0.35%	ASTM E595
Flame Rating	94 V0	UL E331100

Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm)

0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm)

0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

0.5~5 Mm Silicone Gpu Laptop Thermal Conductive Silicon Heating Thermal Pad For Cpu For Heat Sink 1

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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