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High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling

High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling

High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling
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High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIS800
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/pcs
Packaging Details: 24*23*12CM
Delivery Time: 3-6 work days
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Detailed Product Description
Product Name: High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling Keyword: Heat Conduction Insulating Gasket
Application: Chip Heat Sink,Semiconductor Device Cooling Continous Use Temp: -45 To 180℃
Compliance: UL & RoHS Materials: Ceramic Filled Silicone Elastomer / Fiberglass
Feature: Low Thermal Resistant With High Voltage Isolation Thermal Conductive: 1.6W/mK
Highlight:

fiberglass insulation heat resistance

,

thermal insulation sheet

,

Chip Heat Sink Thermal Insulation Sheet

High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

The TIS™800 Series is acomposite of silicone rubber and fiberglass .Thematerial is flame retardant and is specially formulated for use asa thermakky conductive insulator,The primary use for TIS800 isto electrically isolate power sources from heat sinks.TIS 800 hasexcellent mechanical and physical characteristics.Surfaces arepliable and allow complete surface contact with excellent heat.

 

TIS800-Series-Datasheet (1).pdf


Features:
> Highly compliant surface characteristic with high thermal conductivity
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures


Applications:
> Power conversion equipment
> Power semiconductors:To packages, MOSFETs & IGBTs
> Audio and Video components
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

 

Typical Properties of TIS™800 Series
Product Name TIS800 Test Method
Color Gray Visual
Construction &Compostion Ceramic filled silicone elastomer /fiberglass ******
Thickness range 0.127mm-0.457mm ASTM D751
Hardness 65 Shore A ASTM 2240
Specific Gravity 2.2 g/cc ASTM D297
Tensile Strength >1500 psi ASTM D412
Continuos Use Temp -45 to 180℃ ***
Dielectric Breakdown Voltage >1500 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 1.6 W/m-K ASTM D5470
 

Product Thicknesses

TIS 805: 0.127mm

TIS 806: 0.152mm

TIS 808: 0.203mm

TIS 810: 0.254mm

TIS 812: 0.304mm

TIS 818: 0.457mm

 

Product Sizes
8" x 160"(203mm x 48.76M)

Individual die cut shapes can be supplied.
 

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on doule side with "A2" suffix.

 

Reinforcement:
TIS™ series sheets are fiberglass reinforced.

 

High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling 0

Packaging Details & Lead time

 

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Independent R&D team

 

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Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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