Soft Thermally Conductive Electrical Insulator Memory Modules High Temperature 1.3W/MK

Soft Thermally Conductive Electrical Insulator Memory Modules High Temperature 1.3W/MK
 
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
 
The TIS™800K Series products is a high thermal conduction and dielectric performance insulator pad
consisting of a ceramic filled low melting point compound coated on MT Kapton film.
At 50℃, TIS™800K Series begins to soften and flow, filling the microscopic irregularities of both the
thermal solution and the integrated circuit package surface, thereby reducing thermal resistance
 

TIS800K Serice Datasheet-(E)-REV01.pdf

Feature
 
> Broad range of hardnesses available
> Highly compliant surface characteristic
with high thermal conductivity
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures
Application
> Power conversion equipment
> Power semiconductors:
To packages, MOSFETs & IGBTs
> Audio and Video components
> Automotive control units
> Motor controllers
> General high pressure interface
 

Typical Properties of TISTM808K Series
Product Name	TISTM808K
Colour	Light amber
Composite Thickness	0.008" (0.203mm)
Specific Gravity	2.0 g/cc
Heat Capacity	1 l/g-K
Hardness	50 Shore A
Tensile Strength	>13.5 Kpsi
Continuos Use Temp	(-58 to 266℉) / (-50 to 130℃)
Dielectric Breakdown Voltage	>5000 VAC
Dielectric Constant	1.8 MHz
Volume Resistivity	3.5*1014 Ohm-meter
Fire rating	94 V0
Thermal conductivity	1.3 W/m-K

 

Standard Thicknesses:
0.004"(0102mm) 0.005"(0.127mm) 0.006"(0.152mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 100"(254mm x 30.48M)
Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIS™800K series products.
Reinforcement:
TIS800K series sheets are Kapton® reinforced.

 

Why Choose us ?
 
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.