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Customized High Temperature Resistant Thermal Conductive Silicone Pad For Heat Dissipation Of Electronic Products

Customized High Temperature Resistant Thermal Conductive Silicone Pad For Heat Dissipation Of Electronic Products

Customized High Temperature Resistant Thermal Conductive Silicone Pad For Heat Dissipation Of Electronic Products
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Customized High Temperature Resistant Thermal Conductive Silicone Pad For Heat Dissipation Of Electronic Products
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF100-10-02F
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm cantons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Products Name: Customized High Temperature Resistant Thermal Conductive Silicone Pad For Heat Dissipation Of Electronic Products Application: Electronic Products
Thermal Conductivity: 1.0W/mK Hardness: 60 Shore 00
Outgassing(TML): 0.35% Thickness Range: 0.02"(0.5mm)~0.200"(5.0mm)
Color: Gray Keywords: Thermal Conductive Silicone Pad
Highlight:

1.5W/m-K Silicone Thermal Pad

,

94 V0 Silicone Thermal Pad

,

Gray Silicone Thermal Pad

Customized High Temperature Resistant Thermal Conductive Silicone Pad For Heat Dissipation Of Electronic Products

 
The TIF120-02F Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

TIF100-10-02F-Datasheet-REV02 (1).pdf

Customized High Temperature Resistant Thermal Conductive Silicone Pad For Heat Dissipation Of Electronic Products 0
Features
> Good thermal conductive: 1.5W/mK
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance


 
Applications
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

 

 

 Typical Properties of TIF100-10-02F Series
Color
Gray
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.3 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range 0.020"-0.200"
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
60 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

 

>5500 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp

 

-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.35%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X10¹²"
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.0W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Standard Thicknesses:


0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm)

0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm)

0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)


Consult the factory alternate thickness.


Standard Sheets Sizes:


8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:


Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:


TIF™ series sheets type can add with fiberglass reinforced.

 

Customized High Temperature Resistant Thermal Conductive Silicone Pad For Heat Dissipation Of Electronic Products 1

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

 

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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