Name: China company supplied Good thermal conductive 0.5-5.0mmT Heat Dissipation Fins Thermal Gap Filler 1.5W/M-K for CPU
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF1100-01E Series
Price: 4.10 USD
Availability: InStock

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China company supplied Good thermal conductive 0.5-5.0mmT Heat Dissipation Fins Thermal Gap Filler 1.5W/M-K for CPU

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF1100-01E Series

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	242312cm cantons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Color:	Black	Thickness:	0.5-5.0mm
Specific Gravity:	2.3 G/cc	Dielectric Breakdown Voltage:	>5500 VAC
Thermal Conductivity:	1.5W/m-K
Highlight:	Heat Dissipation Fins Thermal Gap Filler , Thermal Gap Filler 1.5W/M-K , 2.5mmT heat dissipation pad

Black Heat Dissipation Fins Thermal Gap Filler For LED - lit Lamps -40 - 160℃ Continuos Use Temp 1.5 W/m-K

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

The TIF1100-01E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-01E Datasheet-REV02.pdf

Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance

Applications

> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> routers
> Telecommunication hardware

Typical Properties of TIF1100-01E Series
Color	BLACK	Visual	Composite Thickness	Thermal Impedance @10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific Gravity	2.3 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness range	0.020"-0.200"	ASTM C351	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	35 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Dielectric Breakdown Voltage	>5500 VAC	ASTM D412	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Outgassing(TML)	0.35%	ASTM E595	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.7 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10" Ohm-meter	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	1.5W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Packaging Details & Lead time

The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

China company supplied Good thermal conductive 0.5-5.0mmT Heat Dissipation Fins Thermal Gap Filler 1.5W/M-K for CPU 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

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