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China company supplied Good thermal conductive 0.5-5.0mmT Heat Dissipation Fins Thermal Gap Filler 1.5W/M-K for CPU

China company supplied Good thermal conductive 0.5-5.0mmT Heat Dissipation Fins Thermal Gap Filler 1.5W/M-K for CPU

  • China company supplied Good thermal conductive 0.5-5.0mmT Heat Dissipation Fins Thermal Gap Filler 1.5W/M-K for CPU
  • China company supplied Good thermal conductive 0.5-5.0mmT Heat Dissipation Fins Thermal Gap Filler 1.5W/M-K for CPU
  • China company supplied Good thermal conductive 0.5-5.0mmT Heat Dissipation Fins Thermal Gap Filler 1.5W/M-K for CPU
China company supplied Good thermal conductive 0.5-5.0mmT Heat Dissipation Fins Thermal Gap Filler 1.5W/M-K for CPU
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF1100-01E Series
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm cantons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Color: Black Thickness: 0.5-5.0mm
Specific Gravity: 2.3 G/cc Dielectric Breakdown Voltage: >5500 VAC
Thermal Conductivity: 1.5W/m-K
High Light:

Heat Dissipation Fins Thermal Gap Filler

,

Thermal Gap Filler 1.5W/M-K

,

2.5mmT heat dissipation pad

Black Heat Dissipati​on Fins Thermal Gap Filler For LED - lit Lamps -40 - 160℃ Continuos Use Temp 1.5 W/m-K

 

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


The TIF1100-01E Series  use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

 

TIF100-01E Datasheet-REV02.pdf


Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance


Applications


LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
routers
Telecommunication hardware

 
                                            Typical Properties of TIF1100-01E Series
 
Color
BLACK
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.3 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range 0.020"-0.200"
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
 35 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

 

>5500 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp

 

-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.35%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.7 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20

 

Volume Resistivity
1.0X10"
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

 
Standard Thicknesses:
 
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
 
Consult the factory to alternate thickness.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 
Packaging Details & Lead time
 
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
 
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

 

China company supplied Good thermal conductive 0.5-5.0mmT Heat Dissipation Fins Thermal Gap Filler 1.5W/M-K for CPU 0

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Company Profile 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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