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2.0mm Thermal Conductive Silicone Pad 2.6W/mK for Heat-Sink GPU

2.0mm Thermal Conductive Silicone Pad 2.6W/mK for Heat-Sink GPU

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF580BS
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Product Ame: China Manufacturer Thermal Conductive Silicone Pad Thickness 2.0mm For Heat-Sink GPU Thickness: 2.0mmT
Hardness: 13 Shore 00 Specific Gravity: 3.0g/cc
Dielectric Breakdown Voltage: >5500 VAC Thermal Conductivity: 2.6W/m-K
Color: Blue Keywords: Thermal Conductive Silicone Pad
Application: Heat-Sink GPU
Highlight:

Silicone Pad for Heat-Sink GPU

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2.0mm Silicone Pad

2.0mm Thermal Conductive Silicone Pad 2.6W/mK for Heat-Sink GPU
Product Specifications
Attribute Value
Product Name China Manufacturer Thermal Conductive Silicone Pad Thickness 2.0mm For Heat-Sink GPU
Thickness 2.0mmT
Hardness 13 Shore 00
Specific Gravity 3.0g/cc
Dielectric Breakdown Voltage >5500 VAC
Thermal Conductivity 2.6W/m-K
Color Blue
Application Heat-Sink GPU
Product Description

China Manufacturer Thermal Conductive Silicone Pad Thickness 2.0mm For Heat-Sink GPU

Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

  • Thermal silicone pad
  • Thermal graphite sheet/film
  • Thermal double-sided tape
  • Thermal insulation pad
  • Thermal ceramic pad
  • Phase change material
  • Thermal grease

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

TIF580BS Series Description

The TIF580BS Series uses a special process with silicone as the base material, adding thermal conductive powder and flame retardant to create an effective thermal interface material that reduces thermal resistance between heat sources and heat sinks.

Features
  • Good thermal conductivity: 2.6W/mK
  • Moldability for complex parts
  • Broad range of hardnesses available
  • High tack surface reduces contact resistance
  • RoHS compliant
  • UL recognized
Applications
  • Cooling components to the chassis of frame
  • High speed mass storage drives
  • Heat Sinking Housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
Technical Specifications
Property Value Test Method
Color Blue Visual
Construction Ceramic filled silicone elastomer
Thermal Conductivity 2.6W/mK ASTM D5470
Hardness 13 Shore 00 ASTM 2240
Specific Gravity 3.0 g/cc ASTM D297
Thickness range 2.0mm ASTM D374
Dielectric Breakdown Voltage (T= 1mm above) >5500 VAC ASTM D149
Dielectric Constant 5.0MHz ASTM D150
Volume Resistivity 2.0X1013 Ohm-meter ASTM D257
Continuous Use Temp -45°C to 200°C
Outgassing (TML) 0.45% ASTM E595
Flame Rating 94-V0 UL E331100

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16" (203mm x 406mm)

Individual die cut shapes and custom thicknesses can be supplied. Please contact us for confirmation.

Packaging & Lead Time

Packaging Details:

  • PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time: Quantity: 5000 pieces (estimated time to be negotiated)

2.0mm Thermal Conductive Silicone Pad 2.6W/mK for Heat-Sink GPU 0
Frequently Asked Questions
Q: Are you a trading company or manufacturer?
A: We are a manufacturer based in China.
Q: How to find the right thermal conductivity for my application?
A: The appropriate thermal conductivity depends on the watts of your power source and heat dissipation requirements. Please provide details about your application and power specifications so we can recommend the most suitable thermal conductive materials.
Q: Do you accept custom orders?
A: Yes, we welcome custom orders. Customization options include dimensions, shape, color, and adhesive coating (single or double-sided) or fiberglass coating. To place a custom order, please provide a drawing or detailed specifications.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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