Low Volatility Thermal Gap Filler Silicone Thermal Pad with 4.0W/mK Thermal Conductivity for Heat Dissipation in Automotive Electronics
Products description
The TIF®100L 4035-06 Series is a soft, low-volatility thermal pad designed specifically for demanding application environments. While providing high thermal conductivity, it significantly reduces the content of volatile silicones. Its high flexibility allows it to fill uneveninterfaces effectively,achieving ultra-low thermal resistance and protecting delicate electronic components from mechanical stress damage. This series is an ideal thermal interface material of choice for fields sensitive to volatile substances, such as aerospace, automotive electronics, optical devices, and high-end communication equipment.
Features
> High thermal conductivity
> Low volatility
> High reliability
> Easy to install and operate
Application:
Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.
| Typical Properties of TIF®100L 4035-06 Series |
| Property |
Value |
Test method |
| Color |
white |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Density(g/cm³) |
3.1 |
ASTM D792 |
| Thickness Range(inch/mm) |
0.010~0.020 |
0.030~0.200 |
ASTM D374 |
| (0.25~0.50) |
(0.75~5.0) |
| Hardness |
65 Shore 00 |
35 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature |
-40 to 200℃ |
****** |
| Breakdown Voltage(V/mm) |
≥5500 |
ASTM D149 |
| Dielectric Constant |
7.3 MHz |
ASTM D150 |
| Volume Resistivity |
＞1.0X1012 Ohm-meter |
ASTM D257 |
| Flame rating |
V-0 |
UL 94 (E331100) |
| Thermal conductivity |
4.0 W/m-K |
ASTM D5470 |
| 4.0 W/m-K |
ISO22007 |
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company profile
Ziitek Technology Company with professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q:Is there promotion price for big buyer?
A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.
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