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Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects

Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects

Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects
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Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: Z-Paster100-15-02F
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-20 USD/pcs
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 1000000pcs/month
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Detailed Product Description
Product Name: Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects Color: Gray/White
Feature: No-silicone Thermal Gap Filler Application: No Silicone Required Projects
Thickness: 0.25-5.0 Mm Keywords: Thermal Gap Pad
Specific Gravity: 2.55g/cc
Highlight:

0.25mm Silicone Free Thermal Pad

,

2.5 mm Silicone Free Thermal Pad

,

1.5 W/mK Silicone Free Thermal Pad

Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects

 

Company Profile

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

Z-Paster100-15-02F Series is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.

 

It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

Z-Paster100-15-02F Series Datasheet-(E)-REV01.pdf

 

Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects 0

 

Features

 

> Silicone-free

> ROSH compliance

> Good thermal conductive:1.5 W/mK

> Soft and Compressible for low stress applications

> Available in varies thickness

 

Application

 

> Cooling components to the chassis of frame

> Car Battery & Power Supply

> Charging Pile

> Silicone-sensitive applications
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules

> CPU
> Display card
> Mainboard/mother board

 

 

 

Typical Properties of Z-Paster100-15-02F Series

Color Gray/White Visual Dielectric Breakdown Voltage (T= 1mm above) >5000 VAC ASTM D149
Construction Silicone-free The metal oxide fills ******* Dielectric Constant 5.5 MHz ASTM D150
Thermal Conductivity 1.5 W/mK ASTM D5470 Volume Resistivity 6.3X1013 Ohm-meter ASTM D257
Hardness 55 Shore 00 ASTM 2240 Continuous Use Temp  –20 To 125 ********
Specific Gravity 2.55 g/cc ASTM D297 Outgassing (TML) 0.30% ASTM E595
Thickness range 0.010"-0.200" (0.25mm-5.0mm) ASTM D374 Flame Rating 94 V0 equivalent to

 

Standard Thicknesses

0.010-inch to 0.200-inch (0.25mm to 5.0mm)

 

Options

Proprietary NS1 option available to eliminate tack from one side to aid in handling.

 

Non-Silicone Thermal Conductive Interface Gap Pad For No Silicone Required Projects 1

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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