Home ProductsThermally Conductive Potting Compound

1.2W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

1.2W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

    • 1.2W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
    • 1.2W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting
  • 1.2W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

    Product Details:

    Place of Origin: China
    Brand Name: Ziitek
    Certification: RoHS
    Model Number: TIE280-12AB

    Payment & Shipping Terms:

    Minimum Order Quantity: 5can
    Price: USD 1-50 / can
    Packaging Details: 1kg/can
    Delivery Time: 3-7 work days
    Payment Terms: T/T
    Supply Ability: 100000can/month
    Contact Now
    Detailed Product Description
    Usage: Potting Application: Capacitors And Electrical Devices
    Thermal Conductivity: 1.2W/MK Keyword: Two Compounds Thermal Glue
    Feature: Design For Potting Of Capacitors And Electrical Devices Name: 1.2W/MK Thermally Conductive Potting Compound

    low temperature cured 1.2W/mK thermal conductive potting compound for potting capacitors and electrical devices

     

    TIE™ 280-12AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.

     

    Features

     

    > Good thermal conductive: 1.2W/mK

    > Excellent insulation and smoothly sourface.

    > Low shrinkage

    > Low viscosity, expediting air releaseed.

    > Excellent in solvents and water proof.

    > Longer life time.

    > Excellent thermal shock efficiecy and impact resistance

     

    Application

     

    > Automotive starters potting; General potting Thermal detector potting

    > Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester

    > Relay sealant; Good adhesion to rubber, ceramics PCB and plastics

    > Power transformers and coils; Potting capacitors Potting of small electrical devices

    > Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant

    > Optical / medical component adhesive

     
    Typical Uncured Material TIE™ 280-12A (Resin)
    Color Black
    Viscosity@25℃ Brookfield 3,000 cPs
    Specific Gravity 1.6 g/cc
    Shelf life @25℃ in sealed container 12 months
    TIE™ 280-12B (Hardener)
    Color Black
    Viscosity@25℃ Brookfield 5,000 cPs
    Shelf life @25℃ in sealed container 12 months

     

    Mix Ratio (By weight) TIE™ 280-12A : TIE™ 280-12B = 100 : 100
    Viscosity @25℃ 4,000 cPs
    Working pot life (250 g @25℃) 45 min
    Specific Gravity 1.6 g/ccn
    Cure Schedule
    Cure 12 hours at 25℃
    Cure 30 minutes at 70℃

     

    Cured Properties
    Hardness @25℃ 85 Shore D
    Service temperature -40℃ to +130℃
    Glass transition temperature Tg 92℃
    Elongation 0.10%
    Coefficient of thermal expansion, / ℃ 3.0 X 10-5
    Fire resistance UL Meet 94 V-0
    Moisture absorption % wt gain 24 hours water immersion @25℃ 0.1

     

    Thermal
    Thermal Impedance @10psi 0.36 ℃-in²/W
    ELECTRICAL AS CURED
    Dielectric Strength 300 volts / mil
    Dielectric Constant 4.2 MHz
    Dissipation factor 0.029 MHz
    Volume resistivity, ohm-cm @ 25℃ 3.0 X 1012

     

    Package: 1kg/can
    1.2W/MK Thermally Conductive Potting Compound Low Temperature Cured Potting

    Contact Details
    Dongguan Ziitek Electronic Materials & Technology Ltd

    Contact Person: Sales Manager

    Send your inquiry directly to us (0 / 3000)

    Other Products