White Color Two Compound 2.8W/m-K Thermal Conductive Putting Compound For LED And Power Drive Potting

White Color Two Compound 2.8W/m-K Thermal Conductive Putting Compound For LED and Power Drive Potting

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Products description

TIS^®680-28AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components .

Features

> Good thermal conductive: 2.8W/mK

> Good electrical insulation performance
> Controllable curing performance
> Flexibly adjustable mechanical properties
> Low viscosity facilitating gas release
> Good solvent and water resistance
> Excellent process compatibility
> Excellent resistance to extreme temperatures

Application

> New energy vehicle electronics
> Industrial electronics and power equipment
> Consumer electronics
> Medical electronics
> Aerospace electronic components
> Rail transit electronic equipment
> Marine detection equipment