White Color Two Compound 2.8W/m-K Thermal Conductive Putting Compound For LED and Power Drive Potting
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
TIS680-28AB-Series-Datasheet.pdf
TIS™ 680-28AB Series is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. lt is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components .
Features
> Good thermal conductive: 2.8W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof.
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance
Application
> To potting LED Lighting heat spreaderand power- driver.
> Ferrite cements; tip type LED; goodcementation to aromatic polyester
> Relay sealant; Good adhesion torubber, ceramics, PCB and plastics
> Power transformers and coils; Potting capacitors; Potting of small electrical devices
> Adhesion to metal glass and plastic;LCD &substrates adhesion; Coatingand sealant; Coil ; IGBTS;
> Transformer; Fire retardant
> Optical / medical component adhesive
| Typical Properties of TIS™ 680-28AB Series |
| Typical Uncured Material |
| TISTM680-28A(Resin) |
Mixing ratio (weight ratio) |
| Color |
white |
A:B=1 :1 |
| Viscosity @25℃ Brookfield |
6000 mPa.s |
Viscosity @25℃ Brookfield |
6000 mPa.s |
| specific Gravity |
2.2g/cc³ |
specific Gravity |
2.2g/cc³ |
| Shelf life @25℃ in sealed container |
6 months |
Working pot life(250g @25℃) |
30 mins |
| TISTM680-28B(Hardener) |
Cure Schedule |
| Color |
White |
Cure at 25C |
3 hrs |
| Viscosity @25℃ Brookfield |
6000 cPs |
| Shelf life @25℃ in sealed container |
6 months |
Cure at 7o°c |
20 mins |
| Cured Properties |
| Hardness (Shore A)@25℃ |
65 Shore A |
| Operating temperature |
-40℃ ~160℃ |
| Glass transition temperature Tg |
92℃ |
| Elongation |
4.00% |
| Coefficient of thermal expansion, /℃ |
5.0x 10^(-5) |
| Fire resistance uL |
94 V-0 |
| Moisture absorption % wt gain 24 hours water immersion @25℃ |
< 0.1 |
| Thermal Conductivity |
2.8W/m-K |
| Thermal Impedance @10psi |
0.28℃*in²/W |
| Dielectric Breakdown Voltage |
400 volts / mil |
| Dielectric Constant@1MHz |
4.2 |
| volume resistivity, ohm-cm @ 25℃ |
3.0x 10^13 |
Packing detais:
1KG A/B for each tank.
5KG A/B each.
10KG A/B each.
Company profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
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