Good Performance Thickness 3mmT Heat Transfer Thermal Silicone Pad For LED Aluminum Plate

Good Performance Thickness 3mmT Heat Transfer Thermal Silicone Pad For LED Aluminum Plate

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Certifications

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

The TIF^®1120-07E Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

Features

> Good thermal conductive: 1.5W/mK

> Soft and compressible for low stress applications
> Available in varies thickness
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions

> Memory Modules
> Mass storage devices