Name: China Company Supplied Good Thermal Conductive 1.5W/MK Thermal Conductive Gap Filler Pad For Cpu
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF1100-07E Series
Price: 4.10 USD
Availability: InStock

Home Products Silicone Thermal Pad

China Company Supplied Good Thermal Conductive 1.5W/MK Thermal Conductive Gap Filler Pad For Cpu

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF1100-07E Series

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Products Name:	China Company Supplied Good Thermal Conductive 1.5W/MK Thermal Conductive Gap Filler Pad For Cpu	Thickness:	2.5mm
Color:	Green	Dielectric Constant @1MHz:	4.7
Breakdown Voltage（V/mm)）:	≥5500	Fire Rating:	94 V-0
Thermal Conductivity:	1.5W/m-K	Keywords:	Thermal Conductive Gap Filler Pad
Application:	AI Processors AI Servers & CPU
Highlight:	5.5MHz Thermal Conductive Gap Filler Pad , CPU Thermal Conductive Gap Filler Pad , ISO14001 Silicone Thermal Pad

China Company Supplied Good Thermal Conductive 1.5W/MK Thermal Conductive Gap Filler Pad For CPU

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

The TIF^®1100-07E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

Features

> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> Easy release construction
> Broad range of hardnesses available

> High tack surface reduces contact resistance
> Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance

Applications

> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> display card

> Micro heat pipe thermal solutions
> Memory Modules

> routers

> Telecommunication hardware

> Heat pipe thermal solutions

>GPS navigation and other portable devices

>Audio and video components

Typical Properties of TIF^®100-07E Series
Property	Value		Test method
Color	Green		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	2.1		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness (Shore 00)	65	35	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	4.7 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	1.5 W/m-K		ASTM D5470
	1.5 W/m-K		ISO22007

Product Specification

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm)with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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China Company Supplied Good Thermal Conductive 1.5W/MK Thermal Conductive Gap Filler Pad For Cpu

China Company Supplied Good Thermal Conductive 1.5W/MK Thermal Conductive Gap Filler Pad For Cpu

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heat conductive pad,

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