Send Message
Home ProductsCPU Thermal Pad

3.0W/MK Ultra Soft Thermally Conductive Pad 27shore00 For RDRAM Memory Modules

3.0W/MK Ultra Soft Thermally Conductive Pad 27shore00 For RDRAM Memory Modules

  • 3.0W/MK Ultra Soft Thermally Conductive Pad 27shore00 For RDRAM Memory Modules
  • 3.0W/MK Ultra Soft Thermally Conductive Pad 27shore00 For RDRAM Memory Modules
  • 3.0W/MK Ultra Soft Thermally Conductive Pad 27shore00 For RDRAM Memory Modules
3.0W/MK Ultra Soft Thermally Conductive Pad 27shore00 For RDRAM Memory Modules
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF5180-30-11U thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
Contact Now
Detailed Product Description
Hardness: 27shore00 KEYWORD: Grey Silicone Rubber Pads
Color: Grey Part Number: TIF5180-30-11U
Material: Silicone Thickness: 4.5mmT
High Light:

3.0W/mK thermal silicone pad

,

thermally conductive pad ultra soft

,

ultra soft thermal silicone pad

3.0W/mK ultra soft thermally conductive silicone rubber 27shore00 For RDRAM memory modules

 

Company Profile

 With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

TIF500-30-11U Datasheet-REV02.pdf

 
The TIF5180-30-11U  is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
 
Features
<Broad range of hardnesses available 3.0W/mK
<Thickness:4.5mmT

<Broad range of hardnesses available

<Moldability for complex parts

<Outstanding thermal performance

 
Applications

<RDRAM memory modules

<Micro heat pipe thermal solutions

<mainboard/mother board

<notebook

<power supply

<LED Controller

<LED Ceilinglamp

 

 
 

 
Typical Properties of TIF 5180-30-11U
 
Product Name
TIF5180-30-11U Series
Colour 
Grey
Construction & Compostion
Ceramic filled silicone rubber
Specific Gravity
3.0g/cc
Dielectric Constant@1MHz 
4.4 MHz
Hardness
27Shore 00
Flame Rating  
94 -V0
Continuos Use Temp
-40to 160℃
Dielectric Breakdown Voltage
>5500 VAC
Thermal conductivity
3.0 W/mK
Thickness
4.5mmT

 

 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

 

 

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

 

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

 
3.0W/MK Ultra Soft Thermally Conductive Pad 27shore00 For RDRAM Memory Modules 0

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

Other Products