Name: Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF100-30-05US
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF100-30-05US

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

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Detailed Product Description

Name:	Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules	Color:	Blue
Dielectric Constant@1MHz:	7.0MHz	Thermal Conductivity:	3.0W/mK
Application:	CPU ,GPU, Memory Modules	Keyword:	CPU Thermal Pad
Recommended Operating Temperature (°C):	-40 To 200℃	Density:	3.0g/cm³
Hardness:	50/20 Shore 00
Highlight:	3.8 mhz cpu thermal pad , cpu thermal pad for memory modules , 3.8 mhz thermal pad for cpu

Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Products description

Ziitek TIF^®100-30-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features

> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications

> Mainboard/mother board

> Notebook

> Power supply

> Heat pipe thermal solutions

> Memory Modules

> Mass storage devices

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card

> Motherboard chip
> Radiator
> AI Processors AI Servers

Typical Properties of TIF^®100-30-05US Series
Property	Value		Test method
Color	Blue		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	50 Shore 00	20 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Thermal Conductivity (W/m-K)	3.0		ASTM D5470
	3.0		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X16" (406 mmX406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1(Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Dielectric Constant 7.0Mhz CPU Thermal Pad Soft Compressible For Memory Modules 1
FAQ

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

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