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Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

  • Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules
  • Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules
Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF1120-30-02US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Dielectric Constant@1MHz: 3.8 MHz Product Name: TIF1120-30-02US Series
Application: Power Supply Color: Gray
Name: Dielectric Constant 3.8 MHz Soft And Compressible Thermal Pad For Memory Modules Keyword: Thermal Gap Pad
High Light:

3.8 mhz cpu thermal pad

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Dielectric constant 3.8 MHz Soft and Compressible Thermal Pad for Memory Modules

 

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

TIF100-30-02US-Datasheet-REV02.pdf

 

Ziitek TIF1120-30-02US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 

<Good thermal conductive:3.0W/mK
<Thickness:3.0mmT
<Hardness:20 Shore 00
<Colour: gray

<RoHS compliant

<UL recognized

<Easy release construction

 
Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

 

 
Typical Properties of TIF1120-30-02US
 
Product Name 

TIF1120-30-02US Series

Colour
Gray
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

2.9 g/cc

Thickness

3.0mmT
Hardness
20 Shore 00
Dielectric constant@1MHz
3.8 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage

>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistivity

1.0*1012 Ohm-cm

 
 

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

 

TIF™ series Individual die cut shapes can be supplied.

 

Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules 0
 

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

 

Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules 1
 
FAQ

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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