Name: 1.5mmt CPU Thermal Pad High Tack Surface Reduces Contact Resistance For IT Infrastructure
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF160-30-05US thermal pad
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

1.5mmt CPU Thermal Pad High Tack Surface Reduces Contact Resistance For IT Infrastructure

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL
Model Number:	TIF160-30-05US thermal pad

Payment & Shipping Terms:

Minimum Order Quantity:	1000 pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-8 work days
Payment Terms:	T/T
Supply Ability:	100000pcs/month

Contact Now

Detailed Product Description

Products Name:	1.5mmt CPU Thermal Pad High Tack Surface Reduces Contact Resistance For IT Infrastructure	Application:	IT Infrastructure
Dielectric Constant:	7.0 MHz	Continuos Use Temp:	-40 To 200℃
Specific Gravity:	3.0 G/cm³	Color:	Blue
Keywords:	CPU Thermal Pad	Construction:	Ceramic Filled Silicone Elastomer
Highlight:	1.5mmt cpu thermal pad , cpu thermal pad for it infrastructure , 1.5mmt thermal pad for cpu

1.5mmT thermal pad High tack surface reduces contact resistance for IT infrastructure

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

TIF^®160-30-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

Features:

> Good thermal conductive: 3.0 W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

Typical Properties of TIF^®100-30-05US Series
Property	Value		Test method
Color	Blue		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.0		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	50 Shore 00	20 Shore 00	ASTM 2240
Recommended Operating Temperature	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Flame rating	V-0		UL 94 (E331100)
Thermal conductivity	3.0 W/m-K		ASTM D5470
	3.0 W/m-K		ISO22007

Product Specification

Product Thicknesses: 0.010"(0.25mm)~ 0.200" (5.00mm) with increments of 0.010"(0.25mm).
Product Sizes: 16" x 16" (406mm x 406mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

1.5mmt CPU Thermal Pad High Tack Surface Reduces Contact Resistance For IT Infrastructure 0

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

1.5mmt CPU Thermal Pad High Tack Surface Reduces Contact Resistance For IT Infrastructure 1
FAQ

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online.

Tag:

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

High Thermal Conductive 8.5W/MK Thermal Management Materais Thermal Pad For Computer CPU/GPU Cooling

Products name: High Thermal Conductive 8.5W/MK Thermal Management Materais Thermal Pad For Computer CPU/GPU Cooling

Thickness range: 0.012"(0.30mm)~0.200"(5.0mm)

Hardness: 35/20 shore00

Keywords: Thermal Management materais

Thermal Management 6.0W Thermal Gap Pads For AI Processors AI Servers

Products name: Thermal Management 6.0W Thermal Gap Pads For AI Processors AI Servers

Thickness range: 0.010"(0.25mm)~0.200"(5.0mm)

Hardness: 65/20 shore00

Keywords: Thermal gap pads

Soft And Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers

Products name: Soft And Electrically Insulating Pad With Exceptional Thermal Conductivity For AI Processors AI Servers

Hardness: 65/27 shore00

Keywords: Electrically Insulating Pad

Color: Dark Gray

3.0 W/Mk Thermal Conductivity Silicone thermal Pad For Heat Pipe Thermal Solutions

Products name: 3.0 W/Mk Thermal Conductivity Silicone thermal Pad For Heat Pipe Thermal Solutions

Hardness: 65/20 shore00

Keywords: Silicone thermal Pad

Color: White

3.0W/Mk High Effective Silicone Gap Filler Pad CPU Pad Blue Color For Power Supply

Products Name: 3.0W/Mk High Effective Silicone Gap Filler Pad CPU Pad Blue Color For Power Supply

Dielectric Constant: 7.0 MHz

Color: blue

Density: 3.0 g/cm³

Fiberglass Reinforced Excellent Insulator Silicone Cpu Thermal Pad For Smd Led Module

Products Name: Fiberglass Reinforced Excellent Insulator Silicone Cpu Thermal Pad For Smd Led Module

Application: Notebook SMD LED module

Continuos Use Temp: -40 to 200℃

Color: blue

2.0mmt CPU Thermal Pad Good Thermal Conductive 3.0W/MK For Automotive Electronics

Products Name: 2.0mmt CPU Thermal Pad Good Thermal Conductive 3.0W/MK For Automotive Electronics

thermal conductive: 3.0W/mK

Dielectric constant @1MHz: 7.0

Continuos Use Temp: -40 to 200℃

1.5mmt CPU Thermal Pad High Tack Surface Reduces Contact Resistance For IT Infrastructure

1.5mmt CPU Thermal Pad High Tack Surface Reduces Contact Resistance For IT Infrastructure

1.5mmt cpu thermal pad

cpu thermal pad for it infrastructure

1.5mmt thermal pad for cpu

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad