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1.5mmt Cpu Thermal Pad High Tack Surface Reduces Contact Resistance For It Infrastructure 

1.5mmt Cpu Thermal Pad High Tack Surface Reduces Contact Resistance For It Infrastructure 

  • 1.5mmt Cpu Thermal Pad High Tack Surface Reduces Contact Resistance For It Infrastructure 
  • 1.5mmt Cpu Thermal Pad High Tack Surface Reduces Contact Resistance For It Infrastructure 
1.5mmt Cpu Thermal Pad High Tack Surface Reduces Contact Resistance For It Infrastructure 
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL
Model Number: TIF160-30-05US thermal pad
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13cm canton
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000pcs/month
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Detailed Product Description
Application: IT Infrastructure Dielectric Constant: 4.0 MHz
Continuos Use Temp: -40to 160℃ Name: 1.5mmT Thermal Pad High Tack Surface Reduces Contact Resistance For IT Infrastructure
Specific Gravity: 3.0 G/cc Color: Blue
High Light:

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1.5mmT thermal pad High tack surface reduces contact resistance for IT infrastructure

 

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.


TIF100-30-05US-Series-Datasheet.pdf

 
TIF160-30-05US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

 

 
<Good thermal conductive:3.0W/mK
<Thickness:1.5mmT
<Hardness:18 Shore 00
<Colour: blue

<RoHS compliant

<UL recognized

<Easy release construction

 
Applications

<Automotive electronics

<Set top boxes

<Audio and video components

<IT infrastructure

<GPS navigation and other portable devices

<CD-Rom, DVD-Rom cooling

 


 

 
Typical Properties of TIF160-30-05US
 
Product Name 

TIF160-30-05US Series

Colour
blue
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

1.5mmT
Hardness
18 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage

>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistiviyt

1.0*1012 Ohm-cm

 

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

1.5mmt Cpu Thermal Pad High Tack Surface Reduces Contact Resistance For It Infrastructure  0
 

 

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

 

1.5mmt Cpu Thermal Pad High Tack Surface Reduces Contact Resistance For It Infrastructure  1
 
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Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Miss. Dana

Tel: +86 18153789196

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