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TIS-30FIP Series Elastomer Gasket Material For Optical And Medical Component Adhesive

TIS-30FIP Series Elastomer Gasket Material For Optical And Medical Component Adhesive

TIS-30FIP Series Elastomer Gasket Material For Optical And Medical Component Adhesive
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TIS-30FIP Series Elastomer Gasket Material For Optical And Medical Component Adhesive
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHS
Model Number: TIS-30FIP
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: 0.1-10 USD/PCS
Packaging Details: 25*24*13mm
Delivery Time: 3-8 work days
Payment Terms: T/T
Supply Ability: 100000 pcs/month
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Detailed Product Description
Products Name: TIS-30FIP Series Elastomer Gasket Material For Optical And Medical Component Adhesive Keywords: Elastomer Gasket Material
Density Cured: 1.6 G/cm³ Structure Constitution: Nickel/ Graphite
Hardness: 45 Shore A Termperature Range: -50~125℃
Application: Medical Component Adhesive
Highlight:

Optical Component Adhesive Elastomer Gasket Material

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Medical Component Adhesive Elastomer Gasket Material

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Elastomer Gasket Material manufacturing

TIS-30FIP Series Elastomer Gasket Material For Optical And Medical Component Adhesive


TIF-30FIP is a Nickel Graphite filled silicone paste with very low hardness which contributes to relatively low compression force when it is used as dispensed gaskets in between of chassis and cover. lt is also designed to beused under high compression rate up to 60% so that the gaskets can compensate large tolerance of substrates. lt also has good shielding performance with balanced mechanical properties.This grade end in a very cost effective FIP solution through its low density and fast dispensing speed.Ziitek's Form-In-Place is an automated system for dispensing conductive elastomer EMl shielding and grounding gaskets onto metal or plastic substrates.This product is particularly ideal for base stations, PDAs, PCcards, radios, mobile phones, as well as many other cast or plastic enclosures and packaged electronic assemblies.

 


FEATURES AND BENEFITS
>Form-in-place gasketing offers a totalcost savings in the form of reduced raw materials, labor or assembly time
> Room temperature cure gasketingmaterials eliminate the need for costly heat curing systems, allowing the use ofinexpensive plastic or metal substrates
>Single-component compounds eliminate the need for mixingingredients, thereby shortening production cycles and eliminating related waste
>Easy to program operating system allows for quick part-topart change-over,minimal tooling investment for new designs, and prototype development in 24 to 48 hours
>Low compression force makes SN compounds an excellent selection wherethe mating surfaces lack mechanical stiffness Form-in-place gaskets provide morecritical packaging space for board level components and smallerpackage dimensions
>High shielding effectiveness:85~100dB up to 10GHz


Applications
>Automotive starters potting; General potting;Thermal detector potting

>Ferrite adhesion;TIP type LED; Good adhesion to aromatic polyester

>Relay sealant; Good adhesion to rubber, ceramics, PCB and plastics
>Power transformers and coils; Potting capacitors; Potting of small electricaldevices
>Adhesion to metal and plastic; LCD & substrates adhesion;Coating andsealant; Coil ; IGBTS; Transformer; Fire retardant
>Optical / medical component adhesive

 

 

 

Typical Properties of TIS-30FIP Series

 

Property Value Test Method
structure constitution
Nickel/Graphite
*****
Shielding Effectiveness 200MHz~10GHz(dB)
>80 MIL-DTL-83528C
Hardness ShoreA 45 ASTM2240
Density cured(g/cm³) 1.6 ASTM D792
Density unccured(g/cm³) 1.8 ASTM D792
Temperature Range
-50~125℃ ******
Volume Resistivity ≤0.04Ω.cm ASTM D257
Compression Range
 10%~60% ASTM D575
20% Compression (lblin)
0.6 ASTM D575
40% Compression (lblin)
1.6 ASTM D575
UL Flammability Rating
94-V0 UL E331100
Adhesion strengh (AL)
>150N/m² LT-FIP-CLE-03
Cure Conditions
15℃ to 40℃,RH50%, 24hours *****
 
Company profile
 
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
 

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Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

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