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High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad

High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad

High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad
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High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF100C 8045-11
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Products Name: High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad Color: Gray
Flam Rating: 94V0 Thermal Conductivity: 8.0 W/mK
Thinkness Range: 0.012"(0.30mm)~0.200"(5.00mm) Certification: RoHS And UL Recognized
Keywords: Silicone Thermal Pad Hardness: 45 Shore 00
Application: CPU And Power Devices
Highlight:

Power Devices Silicone Heat-Conducting Pad

,

CPU Silicone Heat-Conducting Pad

,

High Thermal Conductivity Silicone Pad

High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

TS-TIF®100C 8045-11 series is a silicone-based thermal material designed to fill the gaps between heat-generating components and liquid cooling plates or metal bases.lts flexibility and elasticity make it ideal for covering highly uneven surfaces.With excellent thermal conductivity, it efficiently transfers heat from heat-generating elements or PCBs to liquid cooling plates or metal heat dissipation structures, thereby improving the cooling efficiency of high-power electronic components and extending the lifespan of the equipment.

 

Features:


>Excellent thermal conductivity 8.0W/mK

>Self-adhesive without the need for additional surface adhesive
>Highly compressible, soft, and elastic

>Available in various thicknesses
>Good chemical stability


Applications:

 

>CPU and GPU processors and other chipsets
>High-performance computing (HPC)

>Industrial equipment
>Network communication devices

>New energy vehicles

Typical Properties of TS-TIF®100C 8045-11 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.4g/cc ASTM D297
thickness 0.012"(0.30mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 45 (Shore 00) ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 7.2MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 8.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.012"(0.30mm)-0.200"(5.00mm)
Product Sizes:8" x 16"(203mm x406mm)
Custom die-cut shapes and thicknesses are available.Please contact us for details.
Store in a cool, dry place, away from fire and sunlight.

High Thermal Conductivity Silicone Pad Insulating And Heat Resistant CPU And Power Devices Silicone Heat-Conducting Pad 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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