13.0W/mK Thermal Conductivity Thermal Silicone Pad for CPU with Thinkness Range 0.030"-0.200

Free Sample Heat Transfer Thermal Silicone Pad For CPU

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

TIF^®800Q series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.

Features:
> Excellent thermal conductivity 13.0W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

Applications:
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED drivers and lamps

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm)  with increments of 0.01(0.25mm)

Product Sizes:16" x 16"(406mm x406mm)

 

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).

Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).

The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

 

Q:Do big buyers have promotional prices?

A: Yes, if you are a big buyer in a certain area, Ziitek will provide you with promotional prices, which will help you start your business here. Buyers with long-term cooperation will have better prices.