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Thermal Conductive Silicone Pad for Notebook Memory Motherboard Display Gray Thinkness Range 0.030" 0.75mm -0.200" 5.00mm

Thermal Conductive Silicone Pad for Notebook Memory Motherboard Display Gray Thinkness Range 0.030" 0.75mm -0.200" 5.00mm

Thermal Conductive Silicone Pad for Notebook Memory Motherboard Display Gray Thinkness Range 0.030" 0.75mm -0.200" 5.00mm
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Thermal Conductive Silicone Pad for Notebook Memory Motherboard Display Gray Thinkness Range 0.030" 0.75mm -0.200" 5.00mm
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF800QE
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Features: Naturally Tacky Needing No Further Adhesive Coating Products Name: Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU North-South Computer Accessories
Thermal Conductivity: 13.0W/mK Thinkness Range: 0.030"(0.75mm)~0.200"(5.00mm)
Keywords: Thermal Conductive Silicone Pad Color: Gray
Flam Rating: 94 V-0 Hardness: 35 Shore 00
Application: Notebook Memory Motherboard Display Insulated CPU North-South Computer
Highlight:

Notebook Memory Thermal Conductive Silicone Pad

,

Motherboard Display Thermal Conductive Silicone Pad

,

0.75mm Thermal Conductive Silicone Pad

Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU North-South Computer Accessories

 

Company Profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

TIF®800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.

 

Features:
> Excellent thermal conductivity 13.0W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance


Applications:
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> LED drivers and lamps

> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply

Typical Properties of  TIF®800QE Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.7g/cc ASTM D297
thickness 0.030"(0.75mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 35 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 8.0MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 13.0W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm)  with increments of 0.01(0.25mm)
Product Sizes:16" x 16"(406mm x406mm)
 
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.
Thermal Conductive Silicone Pad for Notebook Memory Motherboard Display Gray Thinkness Range 0.030" 0.75mm -0.200" 5.00mm 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

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