logo
Home ProductsSilicone Thermal Pad

Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Gray Thinkness Range 0.030" 0.75mm -0.200" 5.00mm

Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Gray Thinkness Range 0.030" 0.75mm -0.200" 5.00mm

Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: UL & RoHS
Model Number: TIF800QE
Document: TIF800QE_Data Sheet.pdf
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
Contact Now
Detailed Product Description
Features: Naturally Tacky Needing No Further Adhesive Coating Products Name: Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU North-South Computer Accessories
Thermal Conductivity: 13.0W/mK Thinkness Range(inch/mm): 0.012"(0.30mm)~0.200"(5.00mm)
Keywords: Thermal Conductive Silicone Pad Color: Gray
Flam Rating: 94 V-0 Hardness: 35/40 Shore 00
Application: Notebook, Memory, Motherboard And Display Gray
Highlight:

Notebook Memory Thermal Conductive Silicone Pad

,

Motherboard Display Thermal Conductive Silicone Pad

,

0.75mm Thermal Conductive Silicone Pad

Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display
Thickness Range: 0.030" (0.75mm) - 0.200" (5.00mm)
Thermal Conductive Silicone Pad For Notebook Memory Motherboard Display Insulated CPU North-South Computer Accessories
Company Profile
Ziitek is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive interface pads, thermal grease, thermal conductive plastic, silicone rubber, silicone foams, and phase changing materials. With well-equipped testing equipment and strong technical force.
Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Product Overview
The TIF®800QE series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, allowing it to conform tightly to heat sources with varying shapes and height differences. Even in confined or irregular spaces, it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.
Key Features
  • Excellent thermal conductivity: 13.0W/mK
  • Naturally tacky, needing no further adhesive coating
  • High compliance adapts to various pressure application environments
  • Available in different thickness options
  • Moldability for complex parts
  • Outstanding thermal performance
  • High tack surface reduces contact resistance
Applications
  • Heat dissipation structure for radiators
  • Telecommunication equipment
  • Automotive electronics
  • Battery packs for electric vehicles
  • LED drivers and lamps
  • CPU
  • Display card
  • Mainboard/motherboard
  • Notebook
  • Power supply
Typical Properties of TIF®800QE Series
Property Value Test Method
Color Gray Visual
Construction Ceramic filled silicone elastomer ZKTM J024
Density (g/cm³) 3.45 ASTM D792
Thickness Range (inch/mm) 0.012~0.020 | 0.030~0.200
0.30~0.50 | 0.75~5.00
ASTM D374
Hardness (Shore 00) 40 | 35 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ZKTM J025
Breakdown Strength (V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 13.0 ASTM D5470
Product Specifications
Standard Thickness: 0.012" (0.30mm) ~ 0.200" (5.00mm)
Standard Size: 16" × 16" (406mm × 406mm)
The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
Thermal conductive silicone pad product photo showing gray material with protective film
Packaging Details & Lead Time
Packaging:
  • With PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Meet with customers' requirements - customized
Lead Time: Quantity: 5000 pieces - To be negotiated
Frequently Asked Questions
Q: Are you a trading company or manufacturer?
A: We are a manufacturer in China.
Q: How long is your delivery time?
A: Generally 3-7 work days if goods are in stock, or 7-10 work days if not in stock, depending on quantity.
Q: Do you offer free samples?
A: Yes, we are willing to offer free samples.
Q: What is a Thermal Silicone Pad?
A: A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.
Q: What are the advantages of Thermal Silicone Pads?
A: Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.
Q: Is a thinner Thermal Silicone Pad always better?
A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.

Contact Details
Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

Send your inquiry directly to us (0 / 3000)

Other Products