Name: Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF700NES
Price: 4.10 USD
Availability: InStock

Home Products CPU Thermal Pad

Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF700NES

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-5 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

Contact Now

Detailed Product Description

Products Name:	Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment	Keywords:	Thermal Gap Pad
Thickness:	0.02~0.2inch(0.50~5.0mm)	Specific Gravity:	3.3g/cc
Dielectric Breakdown Voltage:	>5500 VAC	Thermal Conductivity:	6.5W/m-K
Color:	Gray	Operating Temp:	-45~200℃
Application:	Telecommunication Equipment
Highlight:	6.5W/m-K thermal pad for telecom , silica gel CPU thermal pad , thermal conductive pad for equipment

Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment

Company Profile

Ziitek company is a high-tech enterprise dedicated to the R&D, manufacture and sales of thermal interface materials (TIMs). With rich experience in this field, we provide the latest, most effective one-step thermal management solutions. Our facility includes advanced production equipment, full test equipment, and fully automatic coating production lines capable of manufacturing high performance thermal products including:

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

Product introduction

TIF^®700NES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Excellent thermal conductivity: 6.5 W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options

Applications

> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

Typical Properties of TIF^®700NES Series
Property	Value		Test method
Color	Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.3		ASTM D792
Thickness Range(inch/mm)	0.020~0.030	0.040~0.200	ASTM D374
	(0.50~0.75)	(1.00~5.00)
Hardness	60 Shore 00	10 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Thermal Conductivity (W/m-K)	6.5		ASTM D5470
	6.5		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications
Standard Thickness:0.020" (0.5 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size:16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment 0

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Tag:

laptop gpu thermal pad,

cpu cooling pad,

notebook thermal pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Dana Dai

Tel: +86 18153789196

Other Products

Good Insulation Performance Ultra-Soft 6.5W Thermally Gap Pad For AI Server Computer CPU GPU Cooling

Products name: Good Insulation Performance Ultra-Soft 6.5W Thermally Gap Pad For AI Server Computer CPU GPU Cooling

Keywords: Thermal Gap Pad

Thickness: 0.020~0.2inch(0.50~0.75mm)

Specific Gravity: 3.4g/cm³

High Cost-Effective 2.6W/MK CPU Thermal Pad The Outstanding Thermal Performance For Mainboard/Mother Board

Prodcuts name: High Cost-Effective 2.6W/MK CPU Thermal Pad The TIF500US Outstanding Thermal Performance For Mainboard/Mother Board

Thickness: 0.25~5.0mmT(0.010"~0.200")

Specific Gravity: 3.0g/cc

Dielectric Breakdown Voltage: >5500 VAC

Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler

Products name: Thermal Conductive Silicone Pad Heatsink CPU 0.5-5.0mm Thermal Interface Material Thermal Conductive Gap Filler

Keywords: Thermal Conductive Gap Filler

Thickness: 0.010"(0.25mm)~0.200"(5.0mm)

Specific Gravity: 3.0g/cc

3.0W Ultra Soft Thermal Pad With Hardness 12 Shore00 High-Performance Silicone Gap Pads For Electronic Components

Products nameunication Products Lapt: 3.0W Ultra Soft Thermal Pad With Hardness 12 Shore00 High-Performance Silicone Gap Pads For Electronic Components

Thickness: 0.25mm~5.0mm(0.010"~0.200")

Application: Electronic Components

Density: 3.15 g/cm³

3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling

Products nameunication Products Lapt: 3.0W High Temperature Silicone Thermal Gap Pad For Network Communication Products Laptop CPU/GPU Cooling

Thickness: 0.25mm~5.0mm(0.010"~0.200")

Application: Network Communication Products Laptop CPU/GPU Cooling

Density: 3.1 g/cm³

2.8W Electronic Components AI Server Thermal Pads 0.5mm High Quality Thermal Conductivity Insulated Pad

Products name: 2.8W Electronic Components AI Server Thermal Pads 0.5mm High Quality Thermal Conductivity Insulated Pad

Keywords: Thermal Pads

Thickness: 0.25mm~5.0mm(0.010"~0.200")

Density: 3.1 g/cm³

2W Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS Thickness 0.5mmT

Products name: 2W High Quality Factory Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS

Keywords: Thermal Gap Filler

Thickness: 0.5mmT

Specific Gravity: 2.5g/cc

Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment

Extremely Soft 6.5W/M-K Thermal Conductive Silica Gap Pad For Telecom Equipment

6.5W/m-K thermal pad for telecom

silica gel CPU thermal pad

thermal conductive pad for equipment

All products are compliant with UL94 V-0, SGS and ROHS standards.

Certifications: ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL

laptop gpu thermal pad,

cpu cooling pad,