Name: Thermally Silicone Thermal Pad 1.5W/mK Providing Heat Transfer In Electronic Devices And Household Appliance Systems
Brand: Dongguan Ziitek Electronical Material and Technology Co., Ltd
SKU: TIF100-15-01
Price: 4.10 USD
Availability: InStock

Home Products Silicone Thermal Pad

Thermally Silicone Thermal Pad 1.5W/mK Providing Heat Transfer In Electronic Devices And Household Appliance Systems

Product Details:

Place of Origin:	China
Brand Name:	Ziitek
Certification:	UL & RoHS
Model Number:	TIF100-15-01
Document:	TIF100-15-01E_Data Sheet.pdf

Payment & Shipping Terms:

Minimum Order Quantity:	1000pcs
Price:	0.1-10 USD/PCS
Packaging Details:	241312cm cartons
Delivery Time:	3-7 work days
Payment Terms:	T/T
Supply Ability:	1000000 pcs/month

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Detailed Product Description

Products Name:	Thermally Silicone Thermal Pad 1.5W/mK Providing Heat Transfer In Electronic Devices And Household Appliance Systems	Sample:	Sample Free
Fire Rating:	UL 94 V-0	Thickness Range:	0.010"~0.200"(0.25mm~5.0mm)
Color:	Black	Thermal Conductivity:	1.5W/m-K
Dielectric Constant@1MHz:	4.7	Breakdown Voltage（V/mm)）:	≥5500
Keywords:	Thermal Pad	Application:	Electronic Devices And Household Appliance Systems
Highlight:	silicone thermal pad 1.5W/mK , thermal pad for electronic devices , heat transfer pad household appliances

Thermally Silicone Thermal Pad 1.5W/mK Providing Heat Transfer In Electronic Devices And Household Appliance Systems

TIF^®100-15-01E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Key Features

Good thermal conductivity
Moldability for complex parts
Soft and compressible for low stress applications
Naturally tacky needing no further adhesive coating
Available in various thicknesses

Applications

CPU
Display card
Mainboard/mother board
Notebook
Power supply
Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components

Technical Specifications of TIF^®100-15-01E

Property	Value	Test Method
Color	Black	Visual
Construction & Composition	Ceramic filled silicone elastomer	-
Density (g/cm³)	2.3	ASTM D792
Thickness Range (inch/mm)	0.010~0.020 \| 0.030~0.200 0.25~0.50 \| 0.75~5.0	ASTM D374
Hardness (Shore 00)	65 \| 35	ASTM 2240
Recommended Operating Temperature	-40 to 200℃	-
Breakdown Voltage (V/mm)	≥5500	ASTM D149
Dielectric Constant @ 1MHz	4.7	ASTM D150
Volume Resistivity	＞1.0×10¹² Ohm-meter	ASTM D257
Flame Rating	V-0	UL 94 (E331100)
Thermal Conductivity	1.5 W/m-K	ASTM D5470, ISO22007

Product Specifications

Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm ×406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF^® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Packaging & Lead Time

Packaging Details:

PET film or foam for protection
Paper card to separate each layer
Export carton inside and outside
Customized to meet customer requirements

Lead Time: Quantity: 5000 pieces - To be negotiated

Frequently Asked Questions

Q: Are you a trading company or manufacturer?
A: We are manufacturer in China.
Q: What thermal conductivity test method was used?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: How do I place an order?
A: Click the "Send messages" button, fill out the form with your questions and purchase requests, and we will reply as soon as possible via email or online.

About Ziitek

Dongguan Ziitek Electronic Material and Technology Co., Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Tag:

heat conductive pad,

gap filler pad,

thermal cooling pad

Contact Details

Dongguan Ziitek Electronical Material and Technology Co., Ltd

Contact Person: Dana Dai

Tel: +86 18153789196

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Thermally Silicone Thermal Pad 1.5W/mK Providing Heat Transfer In Electronic Devices And Household Appliance Systems

Thermally Silicone Thermal Pad 1.5W/mK Providing Heat Transfer In Electronic Devices And Household Appliance Systems

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