Double Sided Thermal Tape Designed For Heat Dissipation And Secure Bonding Of LED Lights
The TIA®800AL Series is widely used for bonding heat sinks to microprocessors and other power consuming semiconductors. These tapes have strong adhesive strength and good thermal conductivity, aiming to replace traditional mechanical fixation and thermal conductive silicone grease,simplify assembly processes,improve product reliability,and are an ideal choice for solving the heat dissipation challenges of modern compact electronic devices.
Feature
> Thermal Conductivity 1.6W/mK.
> High performance, thermally conductive acrylic adhesive.
> High bond strength to a variety of surfaces.
> Double sided pressure sensitive adhesive tape.
Application
> Mount heat sink onto BGA graphic processor or drive processor.
> Mount heat spreader onto power converter PCB or onto motor control PCB.
> High performance, thermally conductive acrylic adhesive .
> Can be used instead of heat cure adhesive,screw mounting or clip mounting.
| Typical Properties of TIA®806AL Series |
| Products Name |
TIA®806AL |
TIA®806AL |
TIA®806AL |
Test Method |
| Color |
White
|
Visual |
| Adhesive Type |
Acrylic Adhesive
|
- |
| Backing Type |
Aluminum Foil
|
- |
| Recommanded Operating Temperature(℃) |
-40~125
|
- |
| Thickness (inch/mm) |
0.006/ 0.15 |
0.008/0.20 |
0.010/0.25 |
ASTM D374 |
| Breakdown Voltage(V) |
≥ 1000 |
≥ 1200 |
≥ 1500 |
ASTM D149 |
| Thermal Conductivity (W/mK) |
1.6
|
ASTM D5470 |
| 180°Peel Adhesion (gf/inch) Steel, Immediate |
≥ 1200
|
ASTM D149 |
| 180°Peel Adhesion (gf/inch) Steel, 24hrs |
≥ 1400
|
JIS K02378 |
| Holding Power (H/inch) @25℃ |
≥ 48
|
JIS K023711 |
| Holding Power (H/inch) @80℃ |
≥ 48
|
JIS K023711 |
Product Specifications
Standard Thickness:0.006"(0.15 mm),0.008"(0.20 mm),0.010" (0.25 mm)
Standard Size: 16"×100" (406 mmx 30.48 m)
Reinforcing Carrier:TIAB80oAL Series rolls can be reinforced with aluminum foil
The TIA Series can be provided with die-cutting into various shapes.
For different thicknesses or more information about thermally conductive materials,please contact our company.
Packaging Details & Lead time
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Factory profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
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