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TIF020AB-19S

thermal gel
December 30, 2024
Category Connection: Thermal Conductive Gel
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Tags:
#heat transfer putty #thermally conductive gap filler #heat insulation putty
Brief: Discover the TIF020AB-19S Thermally Conductive Putty for CPU and GPU cooling solutions. This high-performance, two-component thermal putty from Ziitek ensures efficient heat dissipation, enhancing the longevity of electronic components. Ideal for notebooks, set-top boxes, and more.
Related Product Features:
  • High thermal conductivity of 2.0W/mK for effective heat dissipation.
  • UL recognized for safety and reliability.
  • Naturally tacky, eliminating the need for additional adhesive.
  • Two-part formulation ensures easy storage and handling.
  • High durability for long-term performance.
  • Optimized shear thinning characteristics for easy dispensing.
  • Suitable for a wide temperature range from -45°C to 200°C.
  • Available in custom packaging for automated dispensing applications.
Faqs:
  • Are you a manufacturer or a trading company?
    We are a manufacturer based in China, specializing in thermal management solutions.
  • How long is the delivery time for the TIF020AB-19S?
    Delivery typically takes 3-7 work days if the goods are in stock, or 7-10 work days if they need to be produced, depending on the quantity ordered.
  • Do you provide samples, and are they free?
    Yes, we offer samples free of charge to help you evaluate our product.
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