TIF030AB-05S

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TIF030AB-05S

thermal gel

December 30, 2024

Category Connection: Thermal Conductive Gel

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Tags:

#heat transfer putty #thermally conductive gap filler #heat insulation putty

Brief: Discover the TIF030AB-05S Thermally Conductive Gel, a high-performance solution for heat dissipation in semiconductors. This two-component gel offers excellent thermal conductivity (3.0W/mK), UL recognition, and easy dispensing for efficient heat management in electronics.

Related Product Features:

High thermal conductivity of 3.0W/mK for effective heat dissipation.
UL recognized for safety and reliability in electronic applications.
Naturally tacky surface eliminates the need for additional adhesives.
Two-part formulation ensures easy storage and handling.
Optimized shear thinning characteristics for smooth dispensing.
Suitable for a wide temperature range from -45°C to 200°C.
Available in custom packaging for automated dispensing applications.
Enhances efficiency and lifespan of heat-generating electronic components.

Faqs:

What is the thermal conductivity of the TIF030AB-05S gel?

The TIF030AB-05S gel has a thermal conductivity of 3.0W/mK, making it highly effective for heat dissipation in electronic devices.
Is the TIF030AB-05S gel UL recognized?

Yes, the TIF030AB-05S gel is UL recognized, ensuring it meets safety and reliability standards for electronic applications.
How can I place an order for the TIF030AB-05S gel?

To place an order, click the 'Send messages' button, fill out the form with your questions and purchase requests, and we will respond promptly via email or online.