TIF050AB-11S

thermal gel
December 30, 2024
Category Connection: Thermal Conductive Gel
Brief: Discover the TIF050AB-11S, a two-component silicone thermally conductive gel material gap filler designed for electronics components. This high-performance solution enhances heat dissipation, ensuring efficiency and longevity for your electronic devices. Ideal for notebooks, set-top boxes, and more.
Related Product Features:
  • Excellent thermal conductivity of 4.0W/mK for efficient heat dissipation.
  • UL recognized and compliant with safety standards.
  • Naturally tacky, eliminating the need for additional adhesive coatings.
  • Two-part formulation ensures easy storage and handling.
  • High durability for long-lasting performance.
  • Optimized shear thinning characteristics for easy dispensing.
  • Suitable for a wide temperature range from -45°C to 200°C.
  • Available in custom packaging for automated dispensing applications.
Faqs:
  • What is the thermal conductivity of TIF050AB-11S?
    The TIF050AB-11S offers excellent thermal conductivity of 4.0W/mK, ensuring efficient heat dissipation for electronic components.
  • Is the TIF050AB-11S compliant with safety standards?
    Yes, the TIF050AB-11S is UL recognized and complies with relevant safety standards, making it a reliable choice for your applications.
  • How can I request customized samples of TIF050AB-11S?
    You can request customized samples by leaving a message on our website, sending an email, or contacting us directly. We will respond promptly to your request.
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