Brief: Discover the TIF050AB-11S, a two-component silicone thermally conductive gel material gap filler designed for electronics components. This high-performance solution enhances heat dissipation, ensuring efficiency and longevity for your electronic devices. Ideal for notebooks, set-top boxes, and more.
Related Product Features:
Excellent thermal conductivity of 4.0W/mK for efficient heat dissipation.
UL recognized and compliant with safety standards.
Naturally tacky, eliminating the need for additional adhesive coatings.
Two-part formulation ensures easy storage and handling.
High durability for long-lasting performance.
Optimized shear thinning characteristics for easy dispensing.
Suitable for a wide temperature range from -45°C to 200°C.
Available in custom packaging for automated dispensing applications.
Faqs:
What is the thermal conductivity of TIF050AB-11S?
The TIF050AB-11S offers excellent thermal conductivity of 4.0W/mK, ensuring efficient heat dissipation for electronic components.
Is the TIF050AB-11S compliant with safety standards?
Yes, the TIF050AB-11S is UL recognized and complies with relevant safety standards, making it a reliable choice for your applications.
How can I request customized samples of TIF050AB-11S?
You can request customized samples by leaving a message on our website, sending an email, or contacting us directly. We will respond promptly to your request.