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5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules
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5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules
Product Details:
Place of Origin: China
Brand Name: Ziitek
Certification: RoHS
Model Number: TIC800G
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Price: 0.1-10 USD/PCS
Packaging Details: 24*23*12cm
Delivery Time: 3-6 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Detailed Product Description
Keyword: Ultra Thin Thermal Conductive Low Melting Point Thermal Pad Feature: Low Melting Point
Thermal Conductivity: 5W/mK Applicatoin: Memory Modules
Setting Temperature: 70℃ For 5 Minutes Features: Low Melting Pcm
High Light:

outlast phase change material

,

phase change thermal pad

Memory Modules applicative grey Ultra thin thermal conductive low melting point thermal pad pcm phase change materials

 

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

 

The TIC™800G Series is low melting point thermal interface material. At 50℃, The TIC™800G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


Features


> 0.014℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required


Applications


> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs

 

 

                                         Typical Properties of TIC™800G Series

 

Product Name
TICTM805G
TICTM808G
TICTM810G
TICTM812G
Testing standards
Color
Gray
Gray
Gray
Gray
Visual
Composite Thickness
0.005"
(0.126mm)
0.008"
(0.203mm)
0.010"
(0.254mm)
0.012"
(0.305mm)
 
Thickness Tolerance
±0.0008''
(±0.019mm)
±0.0008"
(±0.019mm)
±0.0012"
(±0.030mm)
±0.0012"
(±0.030mm)
 
Density
2.6g/cc
Helium Pycnometer
Work Temperature
-25℃~125℃
 
phase transition temperature
50℃~60℃
 
Setting temperature
70℃ for 5 minutes
 
Thermal conductivity
5.0 W/mK
ASTM D5470 (modified)
Thermal lmpedance
@ 50 psi(345 KPa)
0.013℃-in²/W
0.014℃-in²/W
0.038℃-in²/W
0.058℃-in²/W
ASTM D5470 (modified)
0.08℃-cm²/W
0.09℃-cm²/W
0.25℃-cm²/W
0.37℃-cm²/W
 

Standard Thicknesses:
0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.305mm)

Consult the factory alternate thickness.

 

Standard Sizes:
9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

 

Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

 

Reinforcement:
No reinforcement is necessary.

 

5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules 0
 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Contact Details
Dongguan Ziitek Electronical Material and Technology Ltd.

Contact Person: Sales Manager

Tel: +8618153789196

Send your inquiry directly to us (0 / 3000)

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