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5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

    • 5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules
    • 5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules
    • 5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules
  • 5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

    Product Details:

    Place of Origin: China
    Brand Name: Ziitek
    Certification: RoHS
    Model Number: TIC800G

    Payment & Shipping Terms:

    Minimum Order Quantity: 1000pcs
    Price: 0.1-10 USD/PCS
    Packaging Details: 24*23*12cm
    Delivery Time: 3-6 work days
    Payment Terms: T/T
    Supply Ability: 1000000 pcs/month
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    Detailed Product Description
    Keyword: Ultra Thin Thermal Conductive Low Melting Point Thermal Pad Feature: Low Melting Point
    Thermal Conductivity: 5W/mK Applicatoin: Memory Modules
    Setting Temperature: 70℃ For 5 Minutes Features: Low Melting Pcm

    Memory Modules applicative grey Ultra thin thermal conductive low melting point thermal pad pcm phase change materials

     

    The TIC™800G Series is low melting point thermal interface material. At 50℃, The TIC™800G Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800G Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
    The TIC™800G Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.


    Features


    > 0.014℃-in² /W thermal resistance
    > Naturally tacky at room temperature, no adhesive required
    > No heat sink preheating required


    Applications


    > High Frequency Microprocessors
    > Notebook and Desktop PCs
    > Computer Serves
    > Memory Modules
    > Cache Chips
    > IGBTs

     

     

                                             Typical Properties of TIC™800G Series

     

    Product Name
    TICTM805G
    TICTM808G
    TICTM810G
    TICTM812G
    Testing standards
    Color
    Gray
    Gray
    Gray
    Gray
    Visual
    Composite Thickness
    0.005"
    (0.126mm)
    0.008"
    (0.203mm)
    0.010"
    (0.254mm)
    0.012"
    (0.305mm)
     
    Thickness Tolerance
    ±0.0008''
    (±0.019mm)
    ±0.0008"
    (±0.019mm)
    ±0.0012"
    (±0.030mm)
    ±0.0012"
    (±0.030mm)
     
    Density
    2.6g/cc
    Helium Pycnometer
    Work Temperature
    -25℃~125℃
     
    phase transition temperature
    50℃~60℃
     
    Setting temperature
    70℃ for 5 minutes
     
    Thermal conductivity
    5.0 W/mK
    ASTM D5470 (modified)
    Thermal lmpedance
    @ 50 psi(345 KPa)
    0.013℃-in²/W
    0.014℃-in²/W
    0.038℃-in²/W
    0.058℃-in²/W
    ASTM D5470 (modified)
    0.08℃-cm²/W
    0.09℃-cm²/W
    0.25℃-cm²/W
    0.37℃-cm²/W
     

    Standard Thicknesses:
    0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.305mm)

    Consult the factory alternate thickness.

     

    Standard Sizes:
    9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121M)
    TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.

     

    Peressure Sensitive Adhesive:
    Peressure Sensitive Adhesive is not applicable for TIC™800 series products.

     

    Reinforcement:
    No reinforcement is necessary.

     

    5W/mK PCM Phase Change Material Thermal Low Melting Point Memory Modules

    Contact Details
    Dongguan Ziitek Electronic Materials & Technology Ltd

    Contact Person: Sales Manager

    Send your inquiry directly to us (0 / 3000)

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